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LM3S2601-EQC50-A2

Texas Instruments

LM3S2601-EQC50-A2 by Texas Instruments

LM3S2601-EQC50-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. Operating at a max clock frequency of 50 MHz, it is ideal for industrial applications requiring a powerful RISC-based microcontroller with 60 I/O lines and PWM channels for precise control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,667 parts In-Stock

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Digiode

USA . 1,459 parts In-Stock

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1,459

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Distributors (Availability)

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AZTECH Wire

Italy . 265 parts In-Stock

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$14.372

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265

$14.372

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One Stop Electronics

USA . 587 parts In-Stock

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$19.000

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$19.000

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Parana Technologies

USA . 556 parts In-Stock

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$32.211

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$102.342

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556

$32.211

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$102.342

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DigiPath Technology Company

USA . 737 parts In-Stock

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$35.468

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737

$35.468

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ChromeModa Solutions

Germany . 6,751 parts In-Stock

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$36.192

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$29.677

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6,751

$36.192

$29.677

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IDEA Electronic Components Group

UK . 2,160 parts In-Stock

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$36.192

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$34.382

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$32.573

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2,160

$36.192

$34.382

$32.573

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Microchip USA

USA . 483 parts In-Stock

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Corphita

USA . 318 parts In-Stock

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Overview

Unlock the potential of your next project with the LM3S2601-EQC50-A2 microcontroller by Texas Instruments. Known for its high-quality manufacturing, Texas Instruments delivers top-of-the-line microcontrollers that are versatile and reliable. With a wide range of applications in various industries, this microcontroller offers unmatched value and benefits to customers. Whether you're looking for efficient power management or seamless integration, the LM3S2601-EQC50-A2 is the perfect solution for all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Easy to mount on circuit boards, facilitating the assembly process.

Maximum Supply Voltage: 2.75 V

Allows for efficient power consumption while still providing enough voltage for the microcontroller to function properly.

Package Shape: SQUARE

Helps in easy placement on the circuit board, optimizing space utilization.

Bit Size: 32

Provides a relatively high processing capability, allowing for complex functions and calculations to be performed efficiently.

Power Supplies (V): 2.5,3.3

Provides flexibility in power input options for different applications and power requirements.

No. of Terminals: 100

Offers a sufficient number of connection points for interfacing with other components in a circuit.

Package Style (Meter): FLATPACK

Facilitates easy mounting and soldering onto circuit boards, enhancing the overall manufacturing process.

Minimum Supply Voltage: 2.25 V

Ensures that the microcontroller can operate within a stable voltage range, preventing damage due to overvoltage.

Maximum Operating Temperature: 105 °C

Allows for operation in high-temperature environments, expanding the range of applications where the microcontroller can be used.

Minimum Operating Temperature: -40 °C

Enables reliable performance in cold conditions, making the microcontroller suitable for a variety of environments.

Terminal Finish: TIN

Provides a reliable and conductive finish for the terminals, ensuring good electrical connections.

Terminal Position: QUAD

Facilitates easy routing of connections and reduces the risk of signal interference between terminals.

ROM Words: 131072

Provides ample memory storage for storing program instructions and data, allowing for complex applications to be implemented.

Maximum Seated Height: 1.6 mm

Allows for a low-profile design, making the microcontroller suitable for compact electronic devices.

Width: 14 mm

Compact width dimensions enable easy integration into space-constrained designs.

Maximum Clock Frequency: 50 MHz

Provides high processing speed and performance capabilities, enabling rapid data processing and execution of instructions.

Length: 14 mm

Compact length dimensions contribute to a space-efficient design, ideal for small electronic devices.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments with varying temperature conditions, ensuring reliable operation.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient and fast processing of instructions, enhancing overall performance.

RAM Bytes: 32768

Provides sufficient volatile memory for storing data and variables during program execution, enhancing processing capabilities.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable.

Terminal Form: GULL WING

Facilitates easy soldering onto circuit boards, ensuring secure electrical connections.

Nominal Supply Voltage: 2.5 V

Ideal voltage level for stable and efficient operation, ensuring reliable performance.

PWM Channels: YES

Supports Pulse Width Modulation (PWM) functionality for precise control of output signals, enhancing versatility.

ROM Programmability: FLASH

Utilizes Flash memory for reprogrammable and non-volatile storage of program code, enabling easy updates and modifications.

Terminal Pitch: 0.5 mm

Provides fine pitch for compact and space-efficient connection layout on the microcontroller.

Moisture Sensitivity Level (MSL): 3

Designed to withstand moderate moisture exposure during manufacturing and assembly processes, ensuring reliability.

Speed: 50 rpm

Provides fast processing speed for executing instructions and handling data, enhancing overall performance.

No. of I/O Lines: 60

Offers a sufficient number of input/output lines for interfacing with external components and peripherals, increasing versatility.

Technical Specifications

Microcontrollers LM3S2601-EQC50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

60

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S2601-EQC50-A2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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