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LM3S2110-IBZ25-A2T

Texas Instruments

LM3S2110-IBZ25-A2T by Texas Instruments

LM3S2110-IBZ25-A2T by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 0.032 MHz. It features 16384 RAM bytes and 65536 ROM words, suitable for industrial applications requiring PWM channels and ADC functionality.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Vyrian

USA . 5,262 parts In-Stock

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Digiode

USA . 1,692 parts In-Stock

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AZTECH Wire

Italy . 655 parts In-Stock

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$16.608

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655

$16.608

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One Stop Electronics

USA . 915 parts In-Stock

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$26.000

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915

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Microchip USA

USA . 3,425 parts In-Stock

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$45.530

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$44.880

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$44.560

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$44.230

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Parana Technologies

USA . 738 parts In-Stock

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$46.931

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DigiPath Technology Company

USA . 1,368 parts In-Stock

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$51.677

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$47.543

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IDEA Electronic Components Group

UK . 1,745 parts In-Stock

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$52.732

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$50.095

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$47.459

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ChromeModa Solutions

Germany . 1,656 parts In-Stock

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$52.732

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$43.240

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QUARKTWIN TECHNOLOGY LTD

USA . 24,022 parts In-Stock

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Corphita

USA . 3,858 parts In-Stock

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Overview

Elevate your projects with the LM3S2110-IBZ25-A2T by Texas Instruments, a top-of-the-line microcontroller that promises reliability and innovation. As a leading manufacturer, Texas Instruments ensures superior quality and performance in every product they create. This versatile microcontroller is perfect for a wide range of applications, offering customers unmatched value and benefits. Whether you're a seasoned professional or a hobbyist, the LM3S2110-IBZ25-A2T delivers advanced features and capabilities to take your projects to the next level. Experience the difference with this exceptional microcontroller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and cost during production.

Maximum Supply Voltage: 2.75 V

Operating within a maximum supply voltage of 2.75 V ensures efficient power usage and compatibility with low voltage systems.

Package Shape: SQUARE

Square package shape provides ease of handling and placement in electronic designs.

Bit Size: 32

32-bit architecture offers higher processing capabilities and performance for complex tasks in embedded systems.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages allows flexibility in system design and integration.

No. of Terminals: 108

With a high number of terminals, the microcontroller can interface with various external components and peripherals, expanding its functionality.

Package Style (Meter): GRID ARRAY

Grid array package style enables high density mounting, saving space on the circuit board and allowing for compact designs.

Minimum Supply Voltage: 2.25 V

A low minimum supply voltage of 2.25 V ensures efficient operation even in low power scenarios.

Maximum Operating Temperature: 85 °C

Capable of operating at a maximum temperature of 85°C, making it suitable for industrial applications where high temperatures are common.

Minimum Operating Temperature: -40 °C

Operational in temperatures as low as -40°C, ensuring reliability in harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides good conductivity and solderability for reliable connections in the circuit.

ADC Channels: YES

With ADC channels, the microcontroller can convert analog signals to digital data, enabling interfacing with sensors and other analog devices.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy integration into the circuit board layout and allows for efficient heat dissipation.

ROM Words: 65536

Large ROM capacity of 65536 words allows for storing program code and data, supporting complex algorithms and applications.

Technical Specifications

Microcontrollers LM3S2110-IBZ25-A2T attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S2110-IBZ25-A2T Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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