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LM3S1620-IBZ25-A2

Texas Instruments

LM3S1620-IBZ25-A2 by Texas Instruments

LM3S1620-IBZ25-A2 by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It operates at a max clock frequency of 0.032 MHz, suitable for industrial applications requiring PWM channels and ADC channels. With a package style of GRID ARRAY and terminal pitch of 0.8 mm, it offers versatile connectivity options in compact dimensions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,449 parts In-Stock

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4,449

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Digiode

USA . 1,657 parts In-Stock

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1,657

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 747 parts In-Stock

1+ parts

$11.289

100+ parts

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747

$11.289

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One Stop Electronics

USA . 1,062 parts In-Stock

1+ parts

$24.000

100+ parts

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1,062

$24.000

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Microchip USA

USA . 1,780 parts In-Stock

1+ parts

$46.200

100+ parts

$45.540

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$45.210

10k+ parts

$44.880

1,780

$46.200

$45.540

$45.210

$44.880

Parana Technologies

USA . 1,518 parts In-Stock

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$64.866

100+ parts

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1,518

$64.866

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DigiPath Technology Company

USA . 1,355 parts In-Stock

1+ parts

$71.425

100+ parts

$65.711

1k+ parts

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1,355

$71.425

$65.711

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ChromeModa Solutions

Germany . 5,258 parts In-Stock

1+ parts

$72.883

100+ parts

$59.764

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5,258

$72.883

$59.764

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IDEA Electronic Components Group

UK . 1,524 parts In-Stock

1+ parts

$72.883

100+ parts

$69.239

1k+ parts

$65.595

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1,524

$72.883

$69.239

$65.595

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Corphita

USA . 3,883 parts In-Stock

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3,883

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Overview

Unlock the full potential of your next project with the LM3S1620-IBZ25-A2 microcontroller from Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers exceptional reliability and performance. Ideal for a wide range of applications, this microcontroller offers unmatched value with its advanced features and capabilities. Experience seamless integration, enhanced functionality, and increased efficiency with the LM3S1620-IBZ25-A2. Embrace innovation and take your projects to the next level with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, providing good protection for the microcontroller.

Surface Mount: YES

Surface mount technology allows for easier and more efficient PCB assembly.

Maximum Supply Voltage: 2.75 V

This low maximum supply voltage helps to prevent damage to the microcontroller in case of power surges.

Package Shape: SQUARE

Square packages are more space-efficient and easier to handle during manufacturing and assembly.

Bit Size: 32

A 32-bit architecture provides high performance and processing capabilities for various applications.

Power Supplies (V): 2.5,3.3

Support for multiple power supply voltages allows flexibility in designing and operating the microcontroller.

No. of Terminals: 108

Having a large number of terminals enables connectivity to various external components and peripherals.

Package Style (Meter): GRID ARRAY

Grid array packages offer high density packaging and good thermal characteristics for improved performance.

Minimum Supply Voltage: 2.25 V

A low minimum supply voltage ensures reliable operation even under low power conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications where temperature can vary.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation even in harsh environmental conditions.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability.

ADC Channels: YES

Having ADC channels allows the microcontroller to interface with analog sensors and signals.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies PCB design and reduces signal interference.

ROM Words: 131072

Having a large ROM capacity allows for storing a significant amount of program instructions and data.

Maximum Seated Height: 1.5 mm

A low seated height makes this microcontroller suitable for compact and slim device designs.

Width: 10 mm

Compact width dimensions enable efficient use of PCB space and easier integration into various applications.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency allows for fast processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

This spec ensures that the microcontroller can withstand reflow soldering processes without damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable soldering and assembly processes.

Length: 10 mm

Compact length dimensions enable efficient use of PCB space and easier integration into various applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in tough environmental conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides high processing speed and efficiency for various embedded applications.

RAM Bytes: 32768

Having a large RAM capacity allows for efficient data processing and storage during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable performance.

Terminal Form: BALL

Ball terminal form simplifies soldering and connection to the PCB, ensuring reliable electrical contact.

Nominal Supply Voltage: 2.5 V

Having a stable nominal supply voltage ensures consistent and reliable operation of the microcontroller.

PWM Channels: YES

Support for PWM channels enables precise control of connected devices and peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and efficient updating of firmware and software.

Terminal Pitch: 0.8 mm

A narrow terminal pitch enables high-density PCB layouts and space-efficient designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates that the microcontroller has moderate sensitivity to moisture, suitable for standard assembly conditions.

Speed: 25 rpm

Having a high speed rating allows the microcontroller to execute instructions quickly and efficiently.

No. of I/O Lines: 52

With a large number of I/O lines, this microcontroller can interface with multiple external devices and sensors.

Technical Specifications

Microcontrollers LM3S1620-IBZ25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1620-IBZ25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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