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LM3S1150-IBZ50-A2

Texas Instruments

LM3S1150-IBZ50-A2 by Texas Instruments

LM3S1150-IBZ50-A2 by Texas Instruments is a 32-bit microcontroller with 108 terminals, operating at a max frequency of 0.032 MHz. It features 16384 bytes of RAM and 65536 ROM words, suitable for industrial applications requiring PWM and ADC channels. With a temperature range from -40 to 85 °C, this CMOS technology-based microcontroller offers versatile performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,501 parts In-Stock

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4,501

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Digiode

USA . 1,646 parts In-Stock

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1,646

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Distributors (Availability)

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One Stop Electronics

USA . 975 parts In-Stock

1+ parts

$7.000

100+ parts

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975

$7.000

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AZTECH Wire

Italy . 662 parts In-Stock

1+ parts

$8.693

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662

$8.693

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Microchip USA

USA . 2,277 parts In-Stock

1+ parts

$48.090

100+ parts

$47.250

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$46.840

10k+ parts

$46.420

2,277

$48.090

$47.250

$46.840

$46.420

Parana Technologies

USA . 1,415 parts In-Stock

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$66.702

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1,415

$66.702

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DigiPath Technology Company

USA . 2,276 parts In-Stock

1+ parts

$73.447

100+ parts

$67.571

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2,276

$73.447

$67.571

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ChromeModa Solutions

Germany . 1,115 parts In-Stock

1+ parts

$74.946

100+ parts

$61.456

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1,115

$74.946

$61.456

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IDEA Electronic Components Group

UK . 811 parts In-Stock

1+ parts

$74.946

100+ parts

$71.199

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$67.451

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811

$74.946

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$67.451

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Corphita

USA . 4,297 parts In-Stock

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4,297

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Overview

Unleash the power of innovation with the Texas Instruments LM3S1150-IBZ50-A2 microcontroller. With top-notch quality and reliability from a trusted manufacturer, this product offers endless possibilities in various applications. From IoT devices to industrial automation, this microcontroller provides unmatched value, efficiency, and performance. Experience seamless integration, enhanced functionality, and superior results with the LM3S1150-IBZ50-A2. Elevate your projects to new heights with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Surface Mount: YES

Surface mount design allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 2.75 V

Low maximum supply voltage reduces power consumption and extends battery life in applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, especially in compact designs.

Bit Size: 32

32-bit architecture provides enhanced processing power and performance for demanding applications.

Power Supplies (V): 2.5, 3.3

Support for multiple power supply voltages allows for flexibility in different operating conditions.

No. of Terminals: 108

Large number of terminals provide connectivity options for a wide range of peripherals and sensors.

Package Style (Meter): GRID ARRAY

Grid array package style offers improved thermal performance and reliability in high-density applications.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage ensures proper operation even in low-power scenarios.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in harsh environments.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish provides good conductivity and corrosion resistance for long-term reliability.

ADC Channels: YES

Built-in ADC channels enable analog signal processing, expanding the range of applications the microcontroller can be used in.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing, making it easier to integrate the microcontroller into designs.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program code and data, supporting complex applications.

Maximum Seated Height: 1.5 mm

Low maximum seated height enables the microcontroller to be used in slim and compact devices.

Width: 10 mm

Compact width dimension allows for space-efficient placement on the PCB.

Maximum Clock Frequency: 0.032 MHz

High maximum clock frequency supports fast and responsive operation in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering and assembly of the microcontroller.

Peak Reflow Temperature °C: 260

High peak reflow temperature supports reliable solder joints and ensures durability in manufacturing processes.

Length: 10 mm

Compact length dimension allows for space-efficient placement on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in wide temperature ranges, suitable for industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture with dedicated peripherals enhances performance and efficiency in embedded control applications.

RAM Bytes: 16384

Large RAM capacity allows for efficient data processing and multitasking capabilities in the microcontroller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the microcontroller.

Terminal Form: BALL

Ball terminal form provides reliable solder connections and ease of assembly during manufacturing.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and reliability of the microcontroller.

PWM Channels: YES

Built-in PWM channels enable precise control of analog devices, such as motors and LEDs, enhancing the versatility of the microcontroller.

ROM Programmability: FLASH

Flash programmability allows for easy updating of the program code in the microcontroller, facilitating firmware updates and improvements.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enables high-density mounting and compact PCB layouts, saving space and reducing overall footprint.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly.

Speed: 50 rpm

Support for 50 revolutions per minute speed allows for precise timing and control of motor-driven applications.

No. of I/O Lines: 52

Abundance of I/O lines provides extensive connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LM3S1150-IBZ50-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B108

JESD-609 Code:

e1

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

52

No. of Terminals:

108

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA108,12X12,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.5 mm

Speed:

50 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LM3S1150-IBZ50-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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