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LM3S1110-EQC25-A2

Texas Instruments

LM3S1110-EQC25-A2 by Texas Instruments

Texas Instruments' LM3S1110-EQC25-A2 is a 32-bit microcontroller with 65536 ROM words and 16384 RAM bytes. Operating at up to 0.032 MHz, it offers 41 I/O lines and PWM channels for industrial applications requiring a temperature range of -40 to 105 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,245 parts In-Stock

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6,245

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Digiode

USA . 4,229 parts In-Stock

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4,229

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Distributors (Availability)

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AZTECH Wire

Italy . 340 parts In-Stock

1+ parts

$8.839

100+ parts

-

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340

$8.839

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One Stop Electronics

USA . 1,395 parts In-Stock

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$21.000

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1,395

$21.000

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Parana Technologies

USA . 684 parts In-Stock

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$52.289

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684

$52.289

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DigiPath Technology Company

USA . 1,322 parts In-Stock

1+ parts

$57.577

100+ parts

$52.971

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1,322

$57.577

$52.971

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ChromeModa Solutions

Germany . 4,762 parts In-Stock

1+ parts

$58.752

100+ parts

$48.177

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4,762

$58.752

$48.177

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IDEA Electronic Components Group

UK . 1,251 parts In-Stock

1+ parts

$58.752

100+ parts

$55.814

1k+ parts

$52.877

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1,251

$58.752

$55.814

$52.877

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Corphita

USA . 2,173 parts In-Stock

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2,173

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Microchip USA

USA . 159 parts In-Stock

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159

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Overview

Unlock the power of cutting-edge technology with the LM3S1110-EQC25-A2 microcontroller by Texas Instruments. Crafted with precision and expertise, this versatile device offers unrivaled performance in a wide range of applications. From industrial automation to consumer electronics, this microcontroller delivers seamless functionality and reliability. Experience the seamless integration and innovative features of Texas Instruments' quality products, providing you with the competitive edge you need to succeed in today's fast-paced market. Elevate your projects with the LM3S1110-EQC25-A2 and discover the endless possibilities it holds for your next venture.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight yet durable, making the product easy to handle and transport.

Surface Mount: YES

Surface mounting saves space on a PCB and provides more design flexibility.

Maximum Supply Voltage: 2.75 V

Allows for safe operation within the specified voltage range, preventing damage to the microcontroller.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board.

Bit Size: 32

High bit size allows for complex calculations and processing capabilities.

Power Supplies (V): 2.5,3.3

Flexible power supply options for compatibility with different systems.

No. of Terminals: 100

Sufficient terminals for connecting to various components and peripherals.

Package Style (Meter): FLATPACK

Flatpack style ensures easy installation and secure mounting on a PCB.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage allows for operation in low-power applications.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions.

ADC Channels: YES

Analog-to-digital converter channels allow for interfacing with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position enables easy connection and reduces the risk of errors during assembly.

ROM Words: 65536

Large ROM capacity for storing program instructions and data.

Maximum Seated Height: 1.6 mm

Low seated height reduces the overall profile of the product, ideal for space-constrained applications.

Width: 14 mm

Compact width allows for efficient use of space on a PCB.

Maximum Clock Frequency: 0.032 MHz

High clock frequency for fast data processing and real-time operation.

Length: 14 mm

Compact length complements the square package shape for optimal space utilization.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture and microcontroller functionality provide efficient processing and control capabilities.

RAM Bytes: 16384

Sufficient RAM capacity for storing and manipulating data during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and ensure secure connections on a PCB.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance of the microcontroller.

PWM Channels: YES

Pulse-width modulation channels for precise control of analog devices and motors.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the microcontroller without requiring external hardware.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on a PCB for efficient use of space.

Speed: 25 rpm

High-speed processing capabilities for real-time control and data manipulation.

No. of I/O Lines: 41

Sufficient input/output lines for interfacing with external devices and components.

Technical Specifications

Microcontrollers LM3S1110-EQC25-A2 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

.032 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

No. of I/O Lines:

41

No. of Terminals:

100

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Bytes:

16384

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

25 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LM3S1110-EQC25-A2 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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