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JBP24SA41MJ

Texas Instruments

JBP24SA41MJ by Texas Instruments

JBP24SA41MJ by Texas Instruments is a MILITARY-grade OTP ROM with 1KX4 organization, 4096-bit memory density, and 75ns max access time. It operates b/w -55 to 125 °C, making it ideal for high-reliability applications in harsh environments requiring fast data retrieval.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,778 parts In-Stock

1+ parts

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6,778

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Digiode

USA . 71 parts In-Stock

1+ parts

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71

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,126 parts In-Stock

1+ parts

$2.326

100+ parts

$215.964

1k+ parts

$2.093

10k+ parts

-

2,126

$2.326

$215.964

$2.093

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DigiPath Technology Company

USA . 266 parts In-Stock

1+ parts

$2.561

100+ parts

-

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10k+ parts

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266

$2.561

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ChromeModa Solutions

Germany . 6,116 parts In-Stock

1+ parts

$2.613

100+ parts

$2.143

1k+ parts

-

10k+ parts

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6,116

$2.613

$2.143

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IDEA Electronic Components Group

UK . 1,102 parts In-Stock

1+ parts

$2.613

100+ parts

-

1k+ parts

$2.352

10k+ parts

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1,102

$2.613

-

$2.352

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AZTECH Wire

Italy . 595 parts In-Stock

1+ parts

$14.510

100+ parts

-

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595

$14.510

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One Stop Electronics

USA . 593 parts In-Stock

1+ parts

$27.000

100+ parts

-

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593

$27.000

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Corphita

USA . 3,298 parts In-Stock

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3,298

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Overview

Experience the unparalleled quality and reliability of the JBP24SA41MJ by Texas Instruments, a leading manufacturer in the industry. This OTP ROM offers outstanding performance and versatility, making it ideal for a wide range of applications. With its durable ceramic package body material and military-grade temperature grade, this product ensures long-lasting functionality even in harsh conditions. Trust Texas Instruments to provide you with cutting-edge technology that delivers unmatched value and benefits to customers, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal properties, ensuring stable performance over a wide temperature range.

Screening Level: 38535Q/M; 38534H; 883B

High screening levels ensure reliability and quality standards are met, making it suitable for critical applications.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space in the design layout.

No. of Terminals: 18

Sufficient number of terminals for connecting to external circuits and peripherals.

Package Style (Meter): IN-LINE

In-line package style facilitates easy installation and integration into existing systems.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliability in harsh environmental conditions.

Organization: 1KX4

Organized as 1K words of 4 bits each, providing a balance between storage capacity and data width.

Minimum Operating Temperature: -55 °C

Ability to operate at low temperatures makes it suitable for diverse applications.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit layout and connection options.

Temperature Grade: MILITARY

Military-grade temperature range and reliability standards ensure performance in demanding environments.

Technology: TTL

TTL technology provides fast and reliable data processing, suitable for real-time applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide mechanical strength and secure connections.

No. of Words: 1024 words

Ample storage capacity for storing program data or instructions.

Memory Width: 4

Each word is 4 bits wide, suitable for applications requiring small data transfers.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for easy integration and connection with other components.

No. of Words Code: 1K

1K code designation indicates the memory capacity of 1024 words.

Memory Density: 4096 bit

High memory density allows for storing a large amount of data in a compact form factor.

Memory IC Type: OTP ROM

OTP ROM type provides non-volatile memory storage, ensuring data retention without the need for power.

Maximum Access Time: 75 ns

Fast access time enables quick retrieval of data, suitable for high-speed applications.

Technical Specifications

OTP ROM JBP24SA41MJ attributes and parameters. Explore more OTP ROM devices from Texas Instruments

Specs

Maximum Access Time:

75 ns

JESD-30 Code:

R-XDIP-T18

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

18

No. of Words:

1024 words

No. of Words Code:

1K

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

1KX4

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

OTP ROMs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

JBP24SA41MJ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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