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F28M36P63C2ZWTQ

Texas Instruments

F28M36P63C2ZWTQ by Texas Instruments

The Texas Instruments F28M36P63C2ZWTQ is a CMOS microcontroller with TIN SILVER COPPER terminal finish. It can withstand peak reflow temperature of 260°C for up to 30s. This RISC-based peripheral IC is ideal for applications requiring high processing power and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,042 parts In-Stock

1+ parts

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6,042

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Digiode

USA . 3,316 parts In-Stock

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3,316

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,151 parts In-Stock

1+ parts

$2.000

100+ parts

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1,151

$2.000

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One Stop Electronics

USA . 677 parts In-Stock

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$6.000

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677

$6.000

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AZTECH Wire

Italy . 538 parts In-Stock

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$12.149

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538

$12.149

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Parana Technologies

USA . 2,361 parts In-Stock

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$35.777

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2,361

$35.777

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DigiPath Technology Company

USA . 2,043 parts In-Stock

1+ parts

$39.395

100+ parts

$36.243

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2,043

$39.395

$36.243

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ChromeModa Solutions

Germany . 4,623 parts In-Stock

1+ parts

$40.199

100+ parts

$32.963

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4,623

$40.199

$32.963

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IDEA Electronic Components Group

UK . 438 parts In-Stock

1+ parts

$40.199

100+ parts

$38.189

1k+ parts

$36.179

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438

$40.199

$38.189

$36.179

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Northwest PG Solutions

USA . 1,433 parts In-Stock

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$4.607

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1,433

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$4.607

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Corphita

USA . 685 parts In-Stock

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685

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Microchip USA

USA . 446 parts In-Stock

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446

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Native Components

USA . 8 parts In-Stock

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$4.560

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8

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$4.560

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Overview

Unlock the potential of your next project with the F28M36P63C2ZWTQ microcontroller by Texas Instruments. Known for their superior quality and reliability, Texas Instruments offers a wide range of applications for their microcontrollers, providing customers with unmatched performance and efficiency. Whether you are developing IoT devices, industrial automation systems, or consumer electronics, this microcontroller delivers value, benefits, and advantages that will elevate your design to the next level. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Terminal Finish: TIN

Tin terminal finish provides good solderability, ensuring reliable connections during assembly.

Terminal Finish: SILVER

Silver terminal finish offers excellent electrical conductivity, contributing to the overall performance of the microcontroller.

Terminal Finish: COPPER

Copper terminal finish provides durability and corrosion resistance, extending the product's lifespan.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature allows for efficient manufacturing processes, saving time and cost.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability of the components under various operating conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC microcontrollers offer fast and efficient processing capabilities, making them suitable for applications requiring quick response times.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, contributing to energy efficiency and reliability of the microcontroller.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller can withstand moderately humid environments, making it suitable for a wide range of applications.

Technical Specifications

Microcontrollers F28M36P63C2ZWTQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

F28M36P63C2ZWTQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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