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F28M36P53C2ZWTT

Texas Instruments

F28M36P53C2ZWTT by Texas Instruments

The Texas Instruments F28M36P53C2ZWTT microcontroller features a 32-bit CPU with Cortex-M3 family, 524288 ROM words, and 232 RAM words. With 12-Ch 12-Bit ADCs, CAN, Ethernet, I2C, SPI, UART, USB connectivity options and low power mode support, it is ideal for industrial applications requiring high-speed processing and multiple peripherals. Operating in an industrial temperature range of -40 to 105 °C with a max clock frequency of 100 MHz makes it suitable for various embedded systems.

Median Price

$35.628

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,699 parts In-Stock

1+ parts

$26.347

100+ parts

$23.419

1k+ parts

$17.220

10k+ parts

-

1,699

$26.347

$23.419

$17.220

-

Mouser Electronics

USA . 5 parts In-Stock

1+ parts

$44.910

100+ parts

$32.620

1k+ parts

-

10k+ parts

-

5

$44.910

$32.620

-

-

Distributors (In-Stock)

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Digiode

USA . 2,601 parts In-Stock

1+ parts

$25.030

100+ parts

-

1k+ parts

-

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2,601

$25.030

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Vyrian

USA . 3,660 parts In-Stock

1+ parts

-

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3,660

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Distributors (Availability)

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Corphita

USA . 4,022 parts In-Stock

1+ parts

$23.712

100+ parts

-

1k+ parts

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10k+ parts

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4,022

$23.712

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-

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Parana Technologies

USA . 330 parts In-Stock

1+ parts

$27.625

100+ parts

-

1k+ parts

$38.109

10k+ parts

-

330

$27.625

-

$38.109

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DigiPath Technology Company

USA . 689 parts In-Stock

1+ parts

$30.418

100+ parts

$27.985

1k+ parts

-

10k+ parts

-

689

$30.418

$27.985

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-

ChromeModa Solutions

Germany . 1,328 parts In-Stock

1+ parts

$31.039

100+ parts

$25.452

1k+ parts

-

10k+ parts

-

1,328

$31.039

$25.452

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-

IDEA Electronic Components Group

UK . 100 parts In-Stock

1+ parts

$31.039

100+ parts

$29.487

1k+ parts

$27.935

10k+ parts

-

100

$31.039

$29.487

$27.935

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Microchip USA

USA . 1,652 parts In-Stock

1+ parts

$60.800

100+ parts

$59.750

1k+ parts

$59.220

10k+ parts

$58.690

1,652

$60.800

$59.750

$59.220

$58.690

Northwest PG Solutions

USA . 760 parts In-Stock

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100+ parts

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760

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Native Components

USA . 413 parts In-Stock

1+ parts

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413

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Overview

Experience unparalleled performance and reliability with the F28M36P53C2ZWTT microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality products that are perfect for a wide range of applications. This microcontroller offers advanced features and benefits, including high-speed processing, low power consumption, and a multitude of peripherals for seamless connectivity. Whether you're working on IoT devices, consumer electronics, or industrial automation, the F28M36P53C2ZWTT provides the value and efficiency you need to bring your projects to life. Trust Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers due to its durability and cost-effectiveness.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making it suitable for various applications.

Maximum Supply Voltage: 1.32 V

A higher maximum supply voltage provides flexibility in power source options for the microcontroller.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and storage capabilities.

Address Bus Width: 28

A wider address bus width enables the microcontroller to access a larger memory space, increasing its versatility.

Package Shape: SQUARE

Square package shapes are efficient for space utilization and can simplify the PCB layout.

Bit Size: 32

With a bit size of 32, this microcontroller can handle complex data processing tasks and calculations effectively.

No. of Terminals: 289

Having a high number of terminals allows for more connections and interfaces, making it suitable for diverse applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design, improves thermal performance, and allows for high-density mounting.

Minimum Supply Voltage: 1.14 V

A low minimum supply voltage can help reduce power consumption and extend the battery life of the device.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications that require robust performance in harsh conditions.

CPU Family: CORTEX-M3

The Cortex-M3 CPU family is known for its high performance and energy efficiency, making it a reliable choice for a wide range of applications.

No. of External Interrupts: 3

Having multiple external interrupts allows the microcontroller to respond quickly to external events or signals.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microcontroller can function reliably even in cold environments.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections for the microcontroller.

ADC Channels: YES

Analog-to-digital converters (ADC) channels enable the microcontroller to read and process analog signals, expanding its range of applications.

DMA Channels: YES

Direct memory access (DMA) channels help improve data transfer efficiency and offload the CPU, enhancing overall system performance.

Terminal Position: BOTTOM

Bottom terminal position can simplify the PCB layout and assembly process, making it more convenient for integration.

ROM Words: 524288

Having a large ROM capacity allows for storing a significant amount of program instructions, making the microcontroller versatile for various applications.

Maximum Seated Height: 1.4 mm

A low maximum seated height makes it suitable for compact designs and applications with space constraints.

RAM Words: 232

The RAM capacity of 232 words provides adequate memory for temporary data storage and processing tasks.

Width: 16 mm

With a compact width of 16mm, this microcontroller can fit into tight spaces and compact designs.

Boundary Scan: YES

Boundary scan support simplifies testing and debugging processes, improving the reliability and manufacturability of the end product.

External Data Bus Width: 32

A wider external data bus width enables faster data transfer and processing speeds, enhancing overall system performance.

Peripherals: COMPARATOR(6), DMA(32), POR, TIMER(4), WDT(2)

The rich set of peripherals including comparators, DMA, timers, and watchdog timers enhance the functionality and capabilities of the microcontroller.

Maximum Clock Frequency: 100 MHz

A high maximum clock frequency of 100 MHz allows for fast and efficient operation, making it suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature specification ensures the reliability of the soldering process during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the microcontroller can withstand the soldering process without damage.

Length: 16 mm

The compact length of 16mm allows for space-efficient designs and flexibility in placement within a system.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in challenging environmental conditions typically found in industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with reduced instruction set computing (RISC) architecture, it provides efficient and streamlined processing for various applications.

No. of Timers: 4

Multiple timers allow for precise timing control and scheduling of events, enhancing the functionality of the microcontroller.

RAM Bytes: 237568

The substantial RAM capacity of 237568 bytes provides ample space for data storage and processing requirements.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: BALL

Ball terminal form facilitates reliable and compact connections, suitable for applications with space constraints.

Analog To Digital Convertors: 12-Ch 12-Bit

Having multiple channels and high resolution in the analog-to-digital converters supports accurate and efficient analog signal processing.

Maximum Supply Current: 40 mA

The maximum supply current of 40 mA indicates low power consumption, making it energy-efficient and suitable for battery-powered applications.

Nominal Supply Voltage: 1.2 V

A stable nominal supply voltage of 1.2 V ensures consistent and reliable performance of the microcontroller.

No. of DMA Channels: 32

Having 32 DMA channels allows for efficient data transfer and offloads the CPU for improved system performance.

No. of Serial I/Os: 7

Multiple serial I/O interfaces enable communication with other devices, expanding the connectivity options for the microcontroller.

PWM Channels: YES

Pulse-width modulation (PWM) channels enable precise control of signals and outputs, making it suitable for applications requiring accurate modulation.

Connectivity: CAN(2), ETHERNET, I2C(2), SPI(4), UART(5), USB

The diverse connectivity options including CAN, Ethernet, I2C, SPI, UART, and USB offer flexibility in interfacing with various devices and systems.

ROM Programmability: FLASH

Flash ROM programmability allows for easy firmware updates and modifications, enhancing the flexibility and adaptability of the microcontroller.

Terminal Pitch: 0.8 mm

A narrow terminal pitch of 0.8 mm enables high-density mounting and miniaturization of the overall system design.

Format: FLOATING POINT

Support for floating-point format enhances the microcontroller's ability to perform complex mathematical calculations with high precision.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard precautions during storage and handling to prevent damage.

Technical Specifications

Microcontrollers F28M36P53C2ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO HAVING INDEPENDENT COMMUNICATION AND REAL-TIME CONTROL SUBSYSTEMS

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M3

Maximum Clock Frequency:

100 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

3

No. of I/O Lines:

142

No. of Serial I/Os:

7

No. of Terminals:

289

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

237568

RAM Words:

232

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

125 rpm

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(2), SPI(4), UART(5), USB

Peripherals:

COMPARATOR(6), DMA(32), POR, TIMER(4), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

F28M36P53C2ZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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