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F28M36H53B2ZWTS

Texas Instruments

F28M36H53B2ZWTS by Texas Instruments

The Texas Instruments F28M36H53B2ZWTS microcontroller features a peak reflow temperature of 260°C, CMOS technology, and MSL level 3. Ideal for applications requiring high-performance RISC-based microcontrollers with TIN SILVER COPPER terminal finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,457 parts In-Stock

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Digiode

USA . 1,408 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 471 parts In-Stock

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$7.091

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471

$7.091

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One Stop Electronics

USA . 378 parts In-Stock

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$20.000

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378

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Parana Technologies

USA . 1,942 parts In-Stock

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$61.640

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$61.640

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ChromeModa Solutions

Germany . 4,323 parts In-Stock

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$69.258

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$56.792

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$69.258

$56.792

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IDEA Electronic Components Group

UK . 98 parts In-Stock

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$69.258

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$65.795

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$62.332

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98

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$62.332

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Northwest PG Solutions

USA . 1,413 parts In-Stock

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DigiPath Technology Company

USA . 994 parts In-Stock

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$62.443

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Native Components

USA . 212 parts In-Stock

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Corphita

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Microchip USA

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Overview

Unleash the power of innovation with the F28M36H53B2ZWTS Microcontroller by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers cutting-edge technology in the form of this compact yet powerful device. Ideal for a wide range of applications, this microcontroller offers unparalleled performance and reliability. Experience seamless integration and optimal functionality in your projects with the F28M36H53B2ZWTS, setting new standards in efficiency and precision. Elevate your designs with Texas Instruments and take your creations to the next level.

Feature Benefit Bullets

Terminal Finish: TIN

Tin terminal finish provides good solderability, ensuring a reliable connection between the microcontroller and other components on the PCB.

Terminal Finish: SILVER

Silver terminal finish offers excellent conductivity, enhancing the overall performance of the microcontroller in transmitting and receiving signals.

Terminal Finish: COPPER

Copper terminal finish provides a cost-effective option while still offering good conductivity for efficient operation of the microcontroller.

Maximum Time At Peak Reflow Temperature: 30s

With a maximum reflow time of 30 seconds, this microcontroller can undergo reflow soldering processes efficiently, saving time during assembly.

Peak Reflow Temperature: 260C

The high peak reflow temperature of 260°C ensures proper solder melting and reflow for a secure connection, increasing the reliability of the microcontroller.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller uses Reduced Instruction Set Computing (RISC) architecture, which enhances processing speed and efficiency, making it suitable for various applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making this microcontroller energy-efficient and reliable.

Moisture Sensitivity Level (MSL): 3

With MSL 3, the microcontroller can withstand standard reflow soldering processes without the risk of moisture-related damage, ensuring long-term reliability in humid environments.

Technical Specifications

Microcontrollers F28M36H53B2ZWTS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

F28M36H53B2ZWTS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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