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F28M36H33C2ZWTT

Texas Instruments

F28M36H33C2ZWTT by Texas Instruments

The Texas Instruments F28M36H33C2ZWTT is a microcontroller with RISC technology, featuring TIN SILVER COPPER terminal finish. It can withstand peak reflow temperature of 260°C for up to 30s. With MSL level 3, it's ideal for applications requiring high-performance computing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,410 parts In-Stock

1+ parts

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2,410

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Digiode

USA . 1,544 parts In-Stock

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1,544

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 365 parts In-Stock

1+ parts

$9.000

100+ parts

-

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365

$9.000

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Native Components

USA . 703 parts In-Stock

1+ parts

$14.150

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703

$14.150

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Northwest PG Solutions

USA . 804 parts In-Stock

1+ parts

$15.565

100+ parts

$14.008

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-

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804

$15.565

$14.008

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AZTECH Wire

Italy . 287 parts In-Stock

1+ parts

$18.454

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287

$18.454

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One Stop Electronics

USA . 1,169 parts In-Stock

1+ parts

$33.000

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1,169

$33.000

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Parana Technologies

USA . 233 parts In-Stock

1+ parts

$61.240

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233

$61.240

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DigiPath Technology Company

USA . 300 parts In-Stock

1+ parts

$67.433

100+ parts

$62.038

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300

$67.433

$62.038

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ChromeModa Solutions

Germany . 1,873 parts In-Stock

1+ parts

$68.809

100+ parts

$56.423

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1,873

$68.809

$56.423

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IDEA Electronic Components Group

UK . 1,425 parts In-Stock

1+ parts

$68.809

100+ parts

$65.369

1k+ parts

$61.928

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1,425

$68.809

$65.369

$61.928

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Corphita

USA . 1,253 parts In-Stock

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1,253

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Microchip USA

USA . 413 parts In-Stock

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413

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Overview

Discover the cutting-edge F28M36H33C2ZWTT microcontroller by Texas Instruments, a leader in innovative technology solutions. With superior quality and reliability, this microcontroller is perfect for a wide range of applications. From automotive to industrial automation, this product offers unmatched value and benefits to customers seeking high-performance solutions. Experience the advantage of Texas Instruments' expertise in microcontroller technology with the F28M36H33C2ZWTT.

Feature Benefit Bullets

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and longevity of the product.

Maximum Time At Peak Reflow Temperature (s): 30

Having a maximum time of 30 seconds at peak reflow temperature ensures proper soldering of the microcontroller without causing any damage due to overexposure to heat.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microcontroller can withstand high-temperature soldering processes, making it suitable for various manufacturing environments.

Peripheral IC Type: MICROCONTROLLER, RISC

The microcontroller uses Reduced Instruction Set Computing (RISC) architecture, which enhances performance, reduces power consumption, and improves overall efficiency of the product.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption, high noise immunity, and reliability, making the microcontroller suitable for battery-powered devices and noise-sensitive applications.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the microcontroller can withstand exposure to moderately humid environments during storage and handling, ensuring long-term reliability and performance.

Technical Specifications

Microcontrollers F28M36H33C2ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

F28M36H33C2ZWTT Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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