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F28M36H33C2ZWTS

Texas Instruments

F28M36H33C2ZWTS by Texas Instruments

The Texas Instruments F28M36H33C2ZWTS microcontroller features a peak reflow temperature of 260°C, CMOS technology, and RISC architecture. Ideal for applications requiring high processing power in compact designs with Tin Silver Copper terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,386 parts In-Stock

1+ parts

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5,386

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Digiode

USA . 2,971 parts In-Stock

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2,971

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 586 parts In-Stock

1+ parts

$0.394

100+ parts

-

1k+ parts

-

10k+ parts

$0.378

586

$0.394

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-

$0.378

Northwest PG Solutions

USA . 1,100 parts In-Stock

1+ parts

$0.433

100+ parts

-

1k+ parts

-

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$0.382

1,100

$0.433

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-

$0.382

AZTECH Wire

Italy . 192 parts In-Stock

1+ parts

$13.587

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-

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192

$13.587

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One Stop Electronics

USA . 581 parts In-Stock

1+ parts

$24.000

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581

$24.000

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Parana Technologies

USA . 382 parts In-Stock

1+ parts

$56.932

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382

$56.932

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DigiPath Technology Company

USA . 1,745 parts In-Stock

1+ parts

$62.689

100+ parts

$57.674

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1,745

$62.689

$57.674

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ChromeModa Solutions

Germany . 3,127 parts In-Stock

1+ parts

$63.968

100+ parts

$52.454

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3,127

$63.968

$52.454

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IDEA Electronic Components Group

UK . 881 parts In-Stock

1+ parts

$63.968

100+ parts

$60.770

1k+ parts

$57.571

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881

$63.968

$60.770

$57.571

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Corphita

USA . 3,863 parts In-Stock

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3,863

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Microchip USA

USA . 254 parts In-Stock

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254

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Overview

Experience the unparalleled quality and innovation of Texas Instruments with the F28M36H33C2ZWTS microcontroller. Designed for a wide range of applications, this cutting-edge device offers unmatched performance and reliability. With advanced technology and superior manufacturing processes, Texas Instruments ensures that you get the best value for your investment. Trust in the F28M36H33C2ZWTS to deliver exceptional results for your projects.

Feature Benefit Bullets

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, making the product durable and reliable for long-term use.

Terminal Finish: SILVER

Silver terminal finish offers excellent conductivity, ensuring efficient performance and low resistance in electrical connections.

Terminal Finish: COPPER

Copper terminal finish provides good thermal conductivity and is cost-effective, making it a practical choice for heat dissipation in the product.

Maximum Time At Peak Reflow Temperature: 30s

The short time at peak reflow temperature ensures that the components are not exposed to excessive heat, preventing damage and ensuring reliable solder joints.

Peak Reflow Temperature: 260°C

The high peak reflow temperature allows for proper solder melting and reflow, ensuring strong and reliable connections between components.

Peripheral IC Type: MICROCONTROLLER, RISC

The use of a RISC microcontroller provides efficient and fast processing capabilities, making the product suitable for tasks requiring quick response times.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in various operating conditions.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product has a moderate level of moisture sensitivity, requiring standard handling and storage procedures to prevent damage during reflow soldering.

Technical Specifications

Microcontrollers F28M36H33C2ZWTS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

F28M36H33C2ZWTS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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