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F28M36H33B2ZWTS

Texas Instruments

F28M36H33B2ZWTS by Texas Instruments

The Texas Instruments F28M36H33B2ZWTS is a CMOS microcontroller with TIN SILVER COPPER terminal finish. It can withstand peak reflow temperature of 260°C for up to 30s. This RISC peripheral IC is ideal for applications requiring high processing power and reliability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,781 parts In-Stock

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7,781

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Digiode

USA . 1,315 parts In-Stock

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1,315

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Distributors (Availability)

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Native Components

USA . 248 parts In-Stock

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$1.210

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248

$1.210

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Northwest PG Solutions

USA . 446 parts In-Stock

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$1.331

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446

$1.331

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AZTECH Wire

Italy . 208 parts In-Stock

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$12.313

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One Stop Electronics

USA . 1,257 parts In-Stock

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$28.000

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$28.000

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Parana Technologies

USA . 311 parts In-Stock

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$39.384

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311

$39.384

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DigiPath Technology Company

USA . 1,643 parts In-Stock

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$43.367

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$39.898

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$43.367

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ChromeModa Solutions

Germany . 5,320 parts In-Stock

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$44.252

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$36.287

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IDEA Electronic Components Group

UK . 1,455 parts In-Stock

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$44.252

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$42.039

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$39.827

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1,455

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$39.827

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Corphita

USA . 1,592 parts In-Stock

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Microchip USA

USA . 442 parts In-Stock

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Overview

Unleash the power of innovation with the F28M36H33B2ZWTS microcontroller from Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and reliability in all their products. This microcontroller is versatile and can be used in a variety of applications, making it a valuable asset for your projects. Experience seamless performance, efficiency, and ease of use with this cutting-edge technology. Upgrade your designs and stay ahead of the curve with the F28M36H33B2ZWTS microcontroller by Texas Instruments.

Feature Benefit Bullets

Terminal Finish: TIN

TIN finish provides good solderability and corrosion resistance, ensuring reliable connections and longevity of the product.

Terminal Finish: SILVER

SILVER finish offers excellent conductivity, helping in efficient transfer of signals and data within the microcontroller.

Terminal Finish: COPPER

COPPER finish provides high thermal conductivity, aiding in heat dissipation and ensuring the microcontroller operates within safe temperature limits.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds minimizes the exposure of the microcontroller to high temperatures, reducing the risk of damage during assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller can withstand high-temperature reflow soldering processes, ensuring reliable solder joints.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller allows for faster execution of instructions, making it suitable for applications requiring quick processing and response times.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller can withstand exposure to moderate levels of moisture during storage and handling, ensuring its quality is maintained before use.

Technical Specifications

Microcontrollers F28M36H33B2ZWTS attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

F28M36H33B2ZWTS Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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