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DS7832WB

Texas Instruments

DS7832WB by Texas Instruments

DS7832WB by Texas Instruments is a Line Driver & Receiver with 16 terminals, 25 ns max transmit delay, and 5V power supply. Ideal for military applications due to its MIL-graded temperature range of -55 to 125 °C and bipolar technology for differential output.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,336 parts In-Stock

1+ parts

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7,336

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Digiode

USA . 632 parts In-Stock

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632

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,349 parts In-Stock

1+ parts

$4.680

100+ parts

-

1k+ parts

$5.162

10k+ parts

-

2,349

$4.680

-

$5.162

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DigiPath Technology Company

USA . 1,754 parts In-Stock

1+ parts

$5.153

100+ parts

$4.741

1k+ parts

-

10k+ parts

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1,754

$5.153

$4.741

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ChromeModa Solutions

Germany . 4,149 parts In-Stock

1+ parts

$5.258

100+ parts

$4.312

1k+ parts

-

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4,149

$5.258

$4.312

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IDEA Electronic Components Group

UK . 1,032 parts In-Stock

1+ parts

$5.258

100+ parts

-

1k+ parts

$4.732

10k+ parts

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1,032

$5.258

-

$4.732

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AZTECH Wire

Italy . 397 parts In-Stock

1+ parts

$5.625

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397

$5.625

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One Stop Electronics

USA . 318 parts In-Stock

1+ parts

$38.500

100+ parts

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318

$38.500

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Native Components

USA . 885 parts In-Stock

1+ parts

$257.230

100+ parts

$252.085

1k+ parts

$249.513

10k+ parts

$246.941

885

$257.230

$252.085

$249.513

$246.941

Northwest PG Solutions

USA . 1,622 parts In-Stock

1+ parts

$282.953

100+ parts

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1,622

$282.953

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Corphita

USA . 4,649 parts In-Stock

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4,649

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Overview

Experience unparalleled quality and reliability with the DS7832WB by Texas Instruments, a leading manufacturer in the industry. This line driver and receiver offers exceptional performance and versatility for a wide range of applications. With its advanced technology and durable ceramic package body material, this product ensures maximum efficiency and precision. Trust in Texas Instruments to deliver superior products that exceed expectations. Elevate your projects with the DS7832WB and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable and reliable material, ensuring the product can withstand harsh environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards.

Screening Level: 38535Q/M;38534H;883B

Compliance with multiple screening levels ensures high quality and reliability of the product.

Maximum Transmit Delay: 25 ns

Fast transmit delay ensures quick and efficient data transmission.

Power Supplies (V): 5

Compatible with standard 5V power supplies for easy integration into existing systems.

No. of Terminals: 16

Sufficient number of terminals for connectivity and functionality.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for use in various environments.

Output Characteristics: 3-STATE

3-state output allows for high flexibility and control in data transmission.

Differential Output: YES

Differential output helps in reducing noise and interference, ensuring clean and accurate data transmission.

Technology: BIPOLAR

Bipolar technology provides for fast and efficient data transmission.

Technical Specifications

Line Drivers & Receivers DS7832WB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00004 Amp

JESD-30 Code:

R-XDFP-F16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Line Driver or Receivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

25 ns

Trade Compliance

DS7832WB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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