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DS7820J/A+

Texas Instruments

DS7820J/A+ by Texas Instruments

DS7820J/A+ by Texas Instruments is a military-grade line driver with 14 terminals, operating at -55 to 125°C. It features a max output low current of 3.5A and operates on a nominal voltage of 5V. Ideal for applications requiring high reliability in extreme temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,209 parts In-Stock

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5,209

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Digiode

USA . 3,023 parts In-Stock

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3,023

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Anansix

USA . 2,538 parts In-Stock

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2,538

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Distributors (Availability)

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Native Components

USA . 261 parts In-Stock

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$0.180

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$0.173

261

$0.180

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$0.173

Northwest PG Solutions

USA . 957 parts In-Stock

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$0.198

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$0.175

957

$0.198

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$0.175

Parana Technologies

USA . 1,520 parts In-Stock

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$6.019

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$6.794

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1,520

$6.019

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$6.794

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ChromeModa Solutions

Germany . 6,630 parts In-Stock

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$6.763

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$5.546

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6,630

$6.763

$5.546

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IDEA Electronic Components Group

UK . 665 parts In-Stock

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$6.763

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$6.087

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665

$6.763

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$6.087

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AZTECH Wire

Italy . 722 parts In-Stock

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$12.443

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722

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One Stop Electronics

USA . 1,225 parts In-Stock

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$19.500

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$19.500

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Corphita

USA . 3,778 parts In-Stock

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DigiPath Technology Company

USA . 80 parts In-Stock

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$6.098

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Overview

Enhance your electronic designs with the DS7820J/A+ from Texas Instruments. This line driver and receiver offers unparalleled quality and reliability, backed by the trusted reputation of its manufacturer. Ideal for a wide range of applications, this product provides customers with superior performance and precision. With its advanced technology and durable construction, the DS7820J/A+ ensures seamless operation and optimal functionality. Upgrade your projects today with this top-of-the-line component that delivers exceptional value and unmatched benefits.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal properties, making it suitable for high temperatures and harsh environments.

Power Supplies (V): 5

Operates at a standard voltage of 5V, making it compatible with most electronic systems.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures up to 125°C, ensuring reliable performance in various conditions.

Technology: BIPOLAR

Bipolar technology provides high speed and precision in signal amplification and transmission, making it ideal for demanding applications.

Maximum Output Low Current: 3.5 Amp

Capable of delivering a high output current of 3.5 Amp, making it suitable for driving large loads or long transmission lines.

Technical Specifications

Line Drivers & Receivers DS7820J/A+ attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

JESD-609 Code:

e0

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Low Current:

3.5 Amp

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

DS7820J/A+ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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