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DS7832J/883B

Texas Instruments

DS7832J/883B by Texas Instruments

DS7832J/883B by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 5V. It features a max transmit delay of 25ns and operates in military-grade temperatures (-55 to 125°C). Ideal for applications requiring high-speed signal transmission in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,097 parts In-Stock

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Anansix

USA . 2,291 parts In-Stock

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Digiode

USA . 1,210 parts In-Stock

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Electronic Expediters

USA . 188 parts In-Stock

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Bristol Electronics

USA . 166 parts In-Stock

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Atlantic Semiconductor

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Q Components

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Prism Electronics

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Resion

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MISTER SPROCKETS

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AZTECH Wire

Italy . 793 parts In-Stock

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$9.466

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Parana Technologies

USA . 2,255 parts In-Stock

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$10.005

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$10.566

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DigiPath Technology Company

USA . 1,657 parts In-Stock

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ChromeModa Solutions

Germany . 6,665 parts In-Stock

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IDEA Electronic Components Group

UK . 1,427 parts In-Stock

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One Stop Electronics

USA . 1,042 parts In-Stock

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Northwest PG Solutions

USA . 1,991 parts In-Stock

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Corphita

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Native Components

USA . 68 parts In-Stock

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Perfect Parts

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Montclair Electronics, Inc.

USA . 1 parts In-Stock

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Overview

Upgrade your electronics with the DS7832J/883B by Texas Instruments, the top choice for line drivers & receivers. With a MIL-STD-883 Class B screening level and a temperature grade of military, this product ensures reliability in even the most demanding environments. Whether you're working on communication systems or industrial automation, the DS7832J/883B delivers unparalleled performance with its 3-state output characteristics and differential output. Trust Texas Instruments for quality and innovation, and experience the benefits of cutting-edge technology with this versatile interface IC.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection, making the product suitable for rugged environments.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of voltage supplies, increasing flexibility in usage.

No. of Functions: 2

Provides dual functionality in a single package, saving space and simplifying circuit design.

Maximum Transmit Delay: 25 ns

Ensures quick transmission of signals, valuable in applications requiring fast response times.

Power Supplies (V): 5

Common power supply voltage makes integration into existing systems easier.

Maximum Seated Height: 5.08 mm

Low-profile design allows for compact assembly and installation in space-constrained environments.

Differential Output: YES

Enables the product to drive signals across large distances with reduced noise and interference.

Temperature Grade: MILITARY

Designed to operate reliably in harsh temperature conditions, suitable for military and industrial applications.

Technical Specifications

Line Drivers & Receivers DS7832J/883B attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

CONFIGURABLE INTERFACE STANDARDS; INDIVIDUAL ENABLES

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00004 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-GDIP-T16

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Screening Level:

MIL-STD-883 Class B (Modified)

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

25 ns

Width:

7.62 mm

Trade Compliance

DS7832J/883B Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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