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DS7830W/883

Texas Instruments

DS7830W/883 by Texas Instruments

DS7830W/883 by Texas Instruments is a MIL-STD-883 compliant LINE DRIVER with 2 functions, 16ns max transmit delay, and 5V power supply. Ideal for military applications due to its bipolar technology, complementary output polarity, and flatpack package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,006 parts In-Stock

1+ parts

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5,006

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Digiode

USA . 2,680 parts In-Stock

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2,680

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Anansix

USA . 330 parts In-Stock

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330

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AZTECH Wire

Italy . 449 parts In-Stock

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$9.330

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449

$9.330

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Parana Technologies

USA . 2,075 parts In-Stock

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$10.899

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$11.371

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2,075

$10.899

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$11.371

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DigiPath Technology Company

USA . 1,557 parts In-Stock

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$12.001

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$11.041

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1,557

$12.001

$11.041

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ChromeModa Solutions

Germany . 5,769 parts In-Stock

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$12.246

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$10.042

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5,769

$12.246

$10.042

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IDEA Electronic Components Group

UK . 2,335 parts In-Stock

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$12.246

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$11.634

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$11.021

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2,335

$12.246

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$11.021

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One Stop Electronics

USA . 261 parts In-Stock

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$45.500

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261

$45.500

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Corphita

USA . 5,260 parts In-Stock

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Native Components

USA . 837 parts In-Stock

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Northwest PG Solutions

USA . 619 parts In-Stock

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Overview

Upgrade your electronic systems with the DS7830W/883 by Texas Instruments, a top-of-the-line line driver and receiver that guarantees exceptional quality and performance. Manufactured to MIL-STD-883 standards, this product offers unparalleled reliability and precision in a variety of applications. With its complementary output polarity, differential output, and fast transmit delay, the DS7830W/883 is the ideal choice for military-grade technology needs. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-lasting performance in various environments.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Operating Temperature: 125 °C

Can operate effectively in high-temperature conditions, making it suitable for a wide range of applications.

Output Polarity: COMPLEMENTARY

Provides a balanced signal output for improved data transmission and reception.

Differential Output: YES

Allows for noise rejection and improved signal integrity over long distances, ideal for robust communication systems.

Nominal Supply Voltage: 5 V

Operates efficiently within the common 5 V voltage range, making it compatible with many standard electronics.

Technical Specifications

Line Drivers & Receivers DS7830W/883 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00012 Amp

Input Characteristics:

GATED

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-GDFP-F14

JESD-609 Code:

e0

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

1.3 V

Output Characteristics:

TOTEM-POLE

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL14,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.032 mm

Sub-Category:

Line Driver or Receivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

16 ns

Width:

6.35 mm

Trade Compliance

DS7830W/883 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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