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DS7832W

Texas Instruments

DS7832W by Texas Instruments

DS7832W by Texas Instruments is a Line Driver with 16 terminals, offering 25 ns max transmit delay and 0 ns receive delay. Ideal for military applications due to its bipolar technology, operating temperature range of -55 to 125 °C, and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,518 parts In-Stock

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Anansix

USA . 2,681 parts In-Stock

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Digiode

USA . 909 parts In-Stock

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Native Components

USA . 351 parts In-Stock

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$4.946

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Parana Technologies

USA . 1,608 parts In-Stock

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$11.187

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$11.631

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DigiPath Technology Company

USA . 1,250 parts In-Stock

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$12.319

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$11.333

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$12.319

$11.333

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ChromeModa Solutions

Germany . 6,655 parts In-Stock

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$12.570

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$10.307

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IDEA Electronic Components Group

UK . 1,362 parts In-Stock

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$12.570

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$11.942

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$11.313

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One Stop Electronics

USA . 246 parts In-Stock

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$14.500

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AZTECH Wire

Italy . 775 parts In-Stock

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$19.265

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Corphita

USA . 2,938 parts In-Stock

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Northwest PG Solutions

USA . 862 parts In-Stock

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Overview

Elevate your electronic designs with the DS7832W by Texas Instruments, a top-of-the-line line driver that delivers unparalleled quality and performance. Crafted from durable ceramic material, this surface-mount device boasts a sleek rectangular package style with 16 terminals for seamless integration. With a maximum transmit delay of just 25 ns and a high-level input current of 0.00004 Amp, this military-grade technology ensures rapid signal transmission and reliability in extreme temperatures. Whether you're designing communication systems, industrial equipment, or automotive applications, the DS7832W provides unmatched value, efficiency, and precision to meet all your project needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal conductivity and durability, ensuring efficient heat dissipation and long-lasting performance.

Surface Mount: YES

Surface mount technology allows for easy and reliable installation on PCBs, saving space and simplifying assembly processes.

Maximum Transmit Delay: 25 ns

Fast transmit delay ensures quick data transmission, ideal for high-speed communication applications.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with most electronic systems.

No. of Terminals: 16

Sufficient number of terminals for versatile connectivity options in complex circuit designs.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for reliable performance in harsh environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, offering flexibility in bus connectivity and signal isolation.

Differential Output: YES

Differential output helps in reducing noise and interference, improving signal integrity in communication systems.

Technology: BIPOLAR

Bipolar technology provides high-speed performance and precise signal amplification, essential for demanding applications.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliable operation in extreme conditions, meeting stringent quality standards.

Technical Specifications

Line Drivers & Receivers DS7832W attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00004 Amp

Interface IC Type:

JESD-30 Code:

R-XDFP-F16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Sub-Category:

Line Driver or Receivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

25 ns

Trade Compliance

DS7832W Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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