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DS7830J/883

Texas Instruments

DS7830J/883 by Texas Instruments

DS7830J/883 by Texas Instruments is a MIL-STD-883 compliant LINE DRIVER with 2 functions, operating at -55 to 125 °C. It features a max transmit delay of 16 ns and differential output, suitable for military-grade applications requiring high-speed signal transmission in harsh environments.

Median Price

$14.400

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 3 parts In-Stock

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$14.400

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Digiode

USA . 4,881 parts In-Stock

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4,881

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Anansix

USA . 2,662 parts In-Stock

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Vyrian

USA . 1,905 parts In-Stock

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LWI Electronics Inc

India . 15 parts In-Stock

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Electronic Expediters

USA . 1 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 757 parts In-Stock

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$0.116

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$0.111

757

$0.116

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$0.111

Northwest PG Solutions

USA . 13 parts In-Stock

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$0.128

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$0.113

13

$0.128

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$0.113

Parana Technologies

USA . 247 parts In-Stock

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$2.087

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$2.605

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247

$2.087

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DigiPath Technology Company

USA . 547 parts In-Stock

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$2.298

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547

$2.298

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ChromeModa Solutions

Germany . 1,636 parts In-Stock

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$2.345

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$1.923

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IDEA Electronic Components Group

UK . 805 parts In-Stock

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$2.345

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$2.110

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805

$2.345

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$2.110

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AZTECH Wire

Italy . 748 parts In-Stock

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$15.280

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One Stop Electronics

USA . 453 parts In-Stock

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$49.500

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Corphita

USA . 3,130 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Overview

Elevate your electronic designs with the DS7830J/883 by Texas Instruments. This high-quality line driver offers unparalleled reliability and performance, thanks to its MIL-STD-883 screening level and military-grade temperature grade. Perfect for a wide range of applications, from telecommunications to industrial controls, this product ensures precision and efficiency. Trust in Texas Instruments' reputation for excellence and choose the DS7830J/883 for superior results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The package body material is ceramic and glass-sealed, ensuring durability and reliability in various operating conditions.

Maximum Supply Voltage: 5.5 V

Supports a maximum supply voltage of 5.5V, providing flexibility in power supply options for the device.

No. of Functions: 2

Offers 2 functions in a single device, enhancing efficiency and saving space in the circuit design.

Screening Level: MIL-STD-883

Compliant with MIL-STD-883 screening level, ensuring high reliability and quality standards for military applications.

Maximum Transmit Delay: 16 ns

Low maximum transmit delay of 16ns ensures high-speed operation and efficient data transmission.

No. of Terminals: 14

Comes with 14 terminals for easy connectivity and integration into the circuit.

Minimum Supply Voltage: 4.5 V

Supports a minimum supply voltage of 4.5V, allowing for stable operation even with lower power supply levels.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures up to 125°C, making it suitable for harsh environments.

Minimum Operating Temperature: -55 °C

Can withstand extremely low temperatures down to -55°C, ensuring reliable performance in cold conditions.

Terminal Position: DUAL

Features dual terminal positions for enhanced connectivity options and ease of installation.

Differential Output: YES

Supports differential output, reducing noise and interference for improved signal quality.

Temperature Grade: MILITARY

Designed for military-grade applications, meeting stringent requirements for ruggedness and reliability.

Terminal Form: THROUGH-HOLE

Comes with through-hole terminal form, ensuring secure and stable connections on the circuit board.

Technical Specifications

Line Drivers & Receivers DS7830J/883 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

LG-MAX

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

GATED

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-GDIP-T14

Length:

19.939 mm

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

16 ns

Width:

7.62 mm

Trade Compliance

DS7830J/883 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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