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DS7831J

Texas Instruments

DS7831J by Texas Instruments

DS7831J by Texas Instruments is a LINE DRIVER with 2 functions, operating at 5V. It offers a max transmit delay of 25ns and supports differential output. Ideal for military-grade applications requiring high-speed signal transmission in harsh environments.

Median Price

$18.750

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 315 parts In-Stock

1+ parts

-

100+ parts

$15.000

1k+ parts

$13.420

10k+ parts

$12.630

315

-

$15.000

$13.420

$12.630

DigiKey

USA . 315 parts In-Stock

1+ parts

-

100+ parts

$19.740

1k+ parts

-

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315

-

$19.740

-

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Verical

USA . 254 parts In-Stock

1+ parts

-

100+ parts

$18.750

1k+ parts

$16.775

10k+ parts

$15.787

254

-

$18.750

$16.775

$15.787

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,918 parts In-Stock

1+ parts

$15.827

100+ parts

-

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2,918

$15.827

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-

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Vyrian

USA . 4,556 parts In-Stock

1+ parts

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4,556

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Anansix

USA . 1,578 parts In-Stock

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1,578

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-

-

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LWI Electronics Inc

India . 155 parts In-Stock

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155

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ComSIT Distribution GmbH

Germany . 68 parts In-Stock

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68

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ACDS - Activité Composants Distribution Service

France . 28 parts In-Stock

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28

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Holdelec - ElecDif-Pro

France . 28 parts In-Stock

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28

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Prism Electronics

USA . 13 parts In-Stock

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13

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Beltway Electronics Company

USA . 5 parts In-Stock

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5

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ECAB

Sweden . 5 parts In-Stock

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5

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Electronic Expediters

USA . 1 parts In-Stock

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1

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Resion

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Native Components

USA . 179 parts In-Stock

1+ parts

$0.409

100+ parts

-

1k+ parts

-

10k+ parts

$0.392

179

$0.409

-

-

$0.392

Northwest PG Solutions

USA . 606 parts In-Stock

1+ parts

$0.450

100+ parts

-

1k+ parts

-

10k+ parts

$0.397

606

$0.450

-

-

$0.397

Parana Technologies

USA . 398 parts In-Stock

1+ parts

$2.129

100+ parts

-

1k+ parts

$2.642

10k+ parts

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398

$2.129

-

$2.642

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DigiPath Technology Company

USA . 901 parts In-Stock

1+ parts

$2.344

100+ parts

$2.157

1k+ parts

-

10k+ parts

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901

$2.344

$2.157

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ChromeModa Solutions

Germany . 1,107 parts In-Stock

1+ parts

$2.392

100+ parts

$1.961

1k+ parts

-

10k+ parts

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1,107

$2.392

$1.961

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IDEA Electronic Components Group

UK . 449 parts In-Stock

1+ parts

$2.392

100+ parts

-

1k+ parts

$2.153

10k+ parts

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449

$2.392

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$2.153

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Corphita

USA . 2,861 parts In-Stock

1+ parts

$14.994

100+ parts

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2,861

$14.994

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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3,500

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Perfect Parts

USA . 15 parts In-Stock

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15

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Assy Fe

Spain . 12 parts In-Stock

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12

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Overview

Elevate your electronic designs with the DS7831J by Texas Instruments, a top-tier line driver and receiver meticulously crafted from high-quality ceramic materials. This versatile IC boasts fast transmission speeds, precise signal control, and robust performance in a compact rectangular package. Perfect for military-grade applications, this innovative component offers unparalleled reliability and efficiency, ensuring seamless operation even in extreme conditions. Trust Texas Instruments to deliver cutting-edge technology that surpasses expectations every time. Elevate your projects with the DS7831J today.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer excellent thermal properties, making the product more reliable and durable in high temperature environments.

Maximum Supply Voltage: 5.5 V

This high maximum supply voltage allows for compatibility with a wide range of systems and applications.

No. of Functions: 2

Having multiple functions in a single device reduces the space and cost required for additional components, making it a more efficient choice.

Maximum Transmit Delay: 25 ns

The low transmit delay ensures fast and efficient data transmission, suitable for high-speed applications.

Output Characteristics: 3-STATE

The 3-state output allows for flexible control of the output signal, enabling easy integration into various systems.

Technology: BIPOLAR

Bipolar technology offers high speed and precision, making it ideal for demanding applications that require quick response and accurate data transmission.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliable operation in harsh environmental conditions, making it suitable for rugged applications.

Technical Specifications

Line Drivers & Receivers DS7831J attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

LG_MAX

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00004 Amp

Input Characteristics:

GATED

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-XDIP-T16

Length:

19.94 mm

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

25 ns

Width:

7.62 mm

Trade Compliance

DS7831J Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-00-257-9096, 5962002579096, 5962-14-398-8624, 5962143988624, 5962-01-116-1996, 5962011161996

NIIN

002579096, 143988624, 011161996

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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