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DS7831FKB

Texas Instruments

DS7831FKB by Texas Instruments

DS7831FKB by Texas Instruments is a Line Driver & Receiver with 20 terminals, 5V supply voltage, and 25ns max transmit delay. Ideal for military applications due to its ceramic package body material, -55 to 125 °C operating temperature range, and 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,900

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-

-

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Digiode

USA . 1,240 parts In-Stock

1+ parts

-

100+ parts

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1,240

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 711 parts In-Stock

1+ parts

$8.185

100+ parts

-

1k+ parts

$8.795

10k+ parts

-

711

$8.185

-

$8.795

-

DigiPath Technology Company

USA . 267 parts In-Stock

1+ parts

$9.013

100+ parts

$8.292

1k+ parts

-

10k+ parts

-

267

$9.013

$8.292

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-

ChromeModa Solutions

Germany . 1,621 parts In-Stock

1+ parts

$9.197

100+ parts

$7.542

1k+ parts

-

10k+ parts

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1,621

$9.197

$7.542

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IDEA Electronic Components Group

UK . 1,433 parts In-Stock

1+ parts

$9.197

100+ parts

$8.737

1k+ parts

$8.277

10k+ parts

-

1,433

$9.197

$8.737

$8.277

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AZTECH Wire

Italy . 389 parts In-Stock

1+ parts

$11.726

100+ parts

-

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389

$11.726

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One Stop Electronics

USA . 383 parts In-Stock

1+ parts

$22.500

100+ parts

-

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383

$22.500

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Native Components

USA . 289 parts In-Stock

1+ parts

$34.130

100+ parts

-

1k+ parts

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10k+ parts

$32.765

289

$34.130

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-

$32.765

Northwest PG Solutions

USA . 990 parts In-Stock

1+ parts

$37.543

100+ parts

-

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990

$37.543

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Corphita

USA . 4,496 parts In-Stock

1+ parts

-

100+ parts

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4,496

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Overview

Enhance your electronic designs with the DS7831FKB by Texas Instruments, a top-of-the-line Line Driver & Receiver in a ceramic chip carrier package. With a military-grade temperature grade and 3-state output characteristics, this product offers unmatched quality and reliability. Ideal for applications requiring fast transmit delay and differential outputs, this versatile component provides exceptional performance and value. Elevate your projects with the precision and innovation of Texas Instruments technology.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent thermal conductivity and mechanical strength, making the product durable and reliable in various operating conditions.

Maximum Transmit Delay: 25 ns

The low transmit delay ensures fast signal transmission, making this product suitable for applications requiring quick response times.

Power Supplies (V): 5

Operating at 5 volts allows compatibility with standard power supplies, making integration into existing systems easier.

No. of Terminals: 20

Having 20 terminals provides flexibility in connecting to other components or peripherals, expanding the product's functionality.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this product can withstand harsh environmental conditions without compromising performance.

Technology: BIPOLAR

Bipolar technology offers high-speed and high-performance capabilities, making this product ideal for demanding applications.

Technical Specifications

Line Drivers & Receivers DS7831FKB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00004 Amp

JESD-30 Code:

S-XQCC-N20

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Line Driver or Receivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Transmit Delay:

25 ns

Trade Compliance

DS7831FKB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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