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DS7831JB

Texas Instruments

DS7831JB by Texas Instruments

DS7831JB by Texas Instruments is a Line Driver & Receiver with 16 terminals, 5V supply voltage, and 25ns max transmit delay. Ideal for military applications due to its ceramic package, -55 to 125 °C operating temperature range, and 3-STATE output characteristics.

Median Price

$17.039

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Freelance Electronics

USA . 11 parts In-Stock

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$17.039

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$17.891

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$16.869

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Vyrian

USA . 6,567 parts In-Stock

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Digiode

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Electronic Expediters

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Resion

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One Stop Electronics

USA . 791 parts In-Stock

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$2.500

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Parana Technologies

USA . 1,655 parts In-Stock

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$6.840

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$635.165

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$6.156

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DigiPath Technology Company

USA . 1,987 parts In-Stock

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$7.531

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ChromeModa Solutions

Germany . 2,704 parts In-Stock

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$7.685

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$6.302

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IDEA Electronic Components Group

UK . 785 parts In-Stock

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AZTECH Wire

Italy . 833 parts In-Stock

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Corphita

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Northwest PG Solutions

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Overview

Elevate your electronic designs with the DS7831JB by Texas Instruments, a top-of-the-line Line Driver & Receiver that delivers unmatched quality and reliability. Crafted with precision using advanced technology, this product boasts a range of applications in various industries. Experience seamless data transmission and enhanced performance with this military-grade component that offers exceptional value and benefits to customers. Trust Texas Instruments for cutting-edge solutions that elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable and reliable material, ensuring the product has a long lifespan and can withstand harsh environments.

Maximum Transmit Delay: 25 ns

The low transmit delay ensures fast data transmission, making this product suitable for high-speed applications.

Power Supplies (V): 5

Operating at 5V is common in many electronic systems, ensuring compatibility with existing setups.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this product can be used in a variety of environments without the risk of overheating.

Output Characteristics: 3-STATE

3-STATE output allows for the driver/receiver to be turned off, which can help in reducing power consumption when not in use.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V ensures compatibility with standard voltage levels in electronic systems.

Technical Specifications

Line Drivers & Receivers DS7831JB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00004 Amp

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Line Driver or Receivers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

25 ns

Trade Compliance

DS7831JB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-116-1996, 5962011161996

NIIN

011161996

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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