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DS7831W

Texas Instruments

DS7831W by Texas Instruments

DS7831W by Texas Instruments is a ceramic line driver with 16 terminals, operating at temperatures from -55 to 125 °C. It features a max transmit delay of 25 ns and differential output, suitable for military-grade applications requiring fast signal transmission and precise voltage control.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,251 parts In-Stock

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Digiode

USA . 1,918 parts In-Stock

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Anansix

USA . 564 parts In-Stock

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Electronic Expediters

USA . 156 parts In-Stock

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AZTECH Wire

Italy . 536 parts In-Stock

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$5.028

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536

$5.028

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Parana Technologies

USA . 64 parts In-Stock

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$11.624

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$12.020

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$12.020

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ChromeModa Solutions

Germany . 4,201 parts In-Stock

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$13.061

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$10.710

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IDEA Electronic Components Group

UK . 2,033 parts In-Stock

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$13.061

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$12.408

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$11.755

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$13.061

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$11.755

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One Stop Electronics

USA . 698 parts In-Stock

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$13.500

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Corphita

USA . 4,204 parts In-Stock

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Northwest PG Solutions

USA . 948 parts In-Stock

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DigiPath Technology Company

USA . 545 parts In-Stock

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Native Components

USA . 266 parts In-Stock

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Overview

Enhance your electronic designs with the DS7831W by Texas Instruments, a top-quality line driver and receiver that delivers reliable performance for a wide range of applications. Crafted with precision and expertise, this product offers unmatched value and benefits to customers seeking seamless communication solutions. With its advanced technology, durable construction, and efficient operation, the DS7831W is the perfect choice for professionals looking to elevate their projects to the next level. Choose Texas Instruments for superior quality and innovation in every design.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent thermal conductivity, making this product suitable for high temperature environments.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB.

Maximum Transmit Delay: 25 ns

Low transmit delay ensures fast signal transmission, making it ideal for applications requiring quick response times.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of systems and circuits.

No. of Terminals: 16

Having 16 terminals allows for multiple connections and configurations.

Temperature Grade: MILITARY

Military-grade components are designed to withstand extreme temperatures and harsh environments, ensuring reliability in demanding applications.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and low power consumption, making it suitable for high-frequency applications.

Technical Specifications

Line Drivers & Receivers DS7831W attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.00004 Amp

JESD-30 Code:

R-XDFP-F16

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Line Driver or Receivers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

25 ns

Trade Compliance

DS7831W Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-116-5757, 5962011165757

NIIN

011165757

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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