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DS7831J/883

Texas Instruments

DS7831J/883 by Texas Instruments

DS7831J/883 by Texas Instruments is a MILITARY-grade LINE DRIVER with 2 functions. It operates at -55 to 125 °C, with 25 ns max transmit delay. Ideal for applications requiring high-speed data transmission in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,129 parts In-Stock

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Vyrian

USA . 2,025 parts In-Stock

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Digiode

USA . 1,474 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 2 parts In-Stock

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Native Components

USA . 169 parts In-Stock

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$0.784

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Northwest PG Solutions

USA . 1,872 parts In-Stock

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$0.862

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Parana Technologies

USA . 703 parts In-Stock

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$2.649

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$3.138

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703

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DigiPath Technology Company

USA . 1,253 parts In-Stock

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$2.916

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$2.683

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ChromeModa Solutions

Germany . 3,412 parts In-Stock

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$2.976

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$2.440

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IDEA Electronic Components Group

UK . 994 parts In-Stock

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$2.976

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$2.678

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994

$2.976

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AZTECH Wire

Italy . 491 parts In-Stock

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$9.885

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One Stop Electronics

USA . 1,454 parts In-Stock

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$21.500

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Glotronic Ltd.

UK . 3,500 parts In-Stock

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Corphita

USA . 3,407 parts In-Stock

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Overview

Unleash the power of seamless communication with the Texas Instruments DS7831J/883 line driver & receiver. Manufactured to the highest standards, this military-grade device ensures reliability and precision in data transmission. With its differential output and fast transmit delay, it is perfect for a wide range of applications. Experience the value of smooth signal processing and enhanced connectivity with this top-of-the-line product from Texas Instruments. Elevate your projects with the DS7831J/883 today!

Feature Benefit Bullets

Maximum Supply Voltage: 5.5 V

Allows for a wide range of compatible supply voltages, making it versatile for different operating conditions.

No. of Functions: 2

Having multiple functions in one component helps in space-saving and simplifies circuit design.

Screening Level: MIL-STD-883

Meets military screening standards for reliability and performance in harsh environments.

Maximum Transmit Delay: 25 ns

Provides fast data transmission speed for real-time applications.

Minimum Supply Voltage: 4.5 V

Ensures reliable operation even at lower supply voltages.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments without compromising performance.

Minimum Operating Temperature: -55 °C

Able to withstand extremely low temperatures, making it suitable for a wide range of operating conditions.

Maximum Seated Height: 5.08 mm

Low profile design makes it suitable for compact electronic devices.

Width: 7.62 mm

Compact width allows for efficient use of space on a circuit board.

Differential Output: YES

Provides improved noise immunity and signal integrity in communication systems.

Length: 19.94 mm

Optimal length for easy integration into electronic assemblies.

Temperature Grade: MILITARY

Designed to meet stringent military standards for reliability and performance in challenging environments.

Input Characteristics: GATED

Specialized input characteristics for specific application requirements.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with common electronic systems.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy connection to a circuit board.

Driver No. of Bits: 2

Suitable for applications requiring multiple bit data transmission.

Interface IC Type: LINE DRIVER

Specifically designed as a line driver, providing enhanced signal integrity in communication systems.

Technical Specifications

Line Drivers & Receivers DS7831J/883 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

LG_MAX

Differential Output:

YES

Driver No. of Bits:

2

Input Characteristics:

GATED

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

Length:

19.94 mm

No. of Functions:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Code:

DIP

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Temperature Grade:

Terminal Pitch:

2.54 mm

Maximum Transmit Delay:

25 ns

Width:

7.62 mm

Trade Compliance

DS7831J/883 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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