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CSD18511KTTT

Texas Instruments

CSD18511KTTT by Texas Instruments

CSD18511KTTT by Texas Instruments is a N-CHANNEL FET for SWITCHING applications. With 40V DS Breakdown Voltage, it offers 400A IDM and 0.0042 ohm ID. Operating in -55 to 175 °C, this MOSFET has a Drain Connection and 306pF Crss.

Median Price

$1.766

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 87 parts In-Stock

1+ parts

$1.290

100+ parts

-

1k+ parts

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87

$1.290

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Texas Instruments

USA . 4,495 parts In-Stock

1+ parts

$1.741

100+ parts

$1.340

1k+ parts

$0.705

10k+ parts

-

4,495

$1.741

$1.340

$0.705

-

DigiKey

USA . 332 parts In-Stock

1+ parts

$3.120

100+ parts

-

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332

$3.120

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-

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Element14

Singapore . 87 parts In-Stock

1+ parts

-

100+ parts

$1.790

1k+ parts

$1.300

10k+ parts

$1.120

87

-

$1.790

$1.300

$1.120

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,628 parts In-Stock

1+ parts

$1.654

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3,628

$1.654

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Vyrian

USA . 5,738 parts In-Stock

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5,738

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,063 parts In-Stock

1+ parts

$1.011

100+ parts

-

1k+ parts

$1.888

10k+ parts

-

1,063

$1.011

-

$1.888

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DigiPath Technology Company

USA . 837 parts In-Stock

1+ parts

$1.113

100+ parts

$1.024

1k+ parts

-

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837

$1.113

$1.024

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ChromeModa Solutions

Germany . 2,438 parts In-Stock

1+ parts

$1.136

100+ parts

$0.932

1k+ parts

-

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2,438

$1.136

$0.932

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IDEA Electronic Components Group

UK . 368 parts In-Stock

1+ parts

$1.136

100+ parts

-

1k+ parts

$1.022

10k+ parts

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368

$1.136

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$1.022

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Continental Prestige Electronics

USA . 87 parts In-Stock

1+ parts

$1.290

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87

$1.290

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Ampacity Inc.

Singapore . 2,473 parts In-Stock

1+ parts

$1.480

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2,473

$1.480

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Semicontronic

India . 2,230 parts In-Stock

1+ parts

$1.480

100+ parts

$1.443

1k+ parts

$1.436

10k+ parts

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2,230

$1.480

$1.443

$1.436

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Corphita

USA . 376 parts In-Stock

1+ parts

$1.567

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376

$1.567

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Corohmni

South Africa . 251 parts In-Stock

1+ parts

$1.741

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251

$1.741

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Northwest PG Solutions

USA . 1,836 parts In-Stock

1+ parts

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1,836

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Native Components

USA . 237 parts In-Stock

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237

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Overview

Upgrade your power systems with the CSD18511KTTT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Power Field Effect Transistors that are perfect for a variety of applications, from switching to enhancement mode operations. With a maximum pulsed drain current of 400 A and a minimum DS breakdown voltage of 40 V, this N-channel transistor offers unparalleled performance and reliability. Say goodbye to technical headaches and hello to seamless operation with the CSD18511KTTT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, ensuring a long product lifespan.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow and low resistance for effective switching applications.

Configuration: SINGLE

Simplified design and ease of use for single switch applications.

Transistor Application: SWITCHING

Designed specifically for switching purposes, ensuring reliable performance in such applications.

Surface Mount: YES

Allows for easy and space-saving installation on circuit boards.

Minimum DS Breakdown Voltage: 40 V

Provides a suitable safety margin for voltage spikes and overloads.

Maximum Pulsed Drain Current (IDM): 400 A

Capable of handling high current pulses, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 156 mJ

Ability to withstand high energy spikes, ensuring reliable operation in harsh conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers efficient performance and low power consumption for enhanced energy efficiency.

Maximum Operating Temperature: 175 °C

Can operate efficiently in high-temperature environments without degradation in performance.

Moisture Sensitivity Level (MSL): 2

Moderate moisture sensitivity level, suitable for a range of operating conditions.

Technical Specifications

Power Field Effect Transistors (FET) CSD18511KTTT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

156 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

110 A

Maximum Drain-Source On Resistance:

.0042 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

306 pF

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD18511KTTT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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