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CLVTH16240IDGGREP

Texas Instruments

CLVTH16240IDGGREP by Texas Instruments

CLVTH16240IDGGREP by Texas Instruments is a 4-bit bus driver with 3-STATE output, operating at -40 to 85 °C. It features a propagation delay of 4 ns and supports a supply voltage range of 2.7V to 3.6V. Ideal for industrial applications requiring high-speed signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,139 parts In-Stock

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Vyrian

USA . 2,272 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 477 parts In-Stock

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$1.202

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477

$1.202

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Northwest PG Solutions

USA . 1,321 parts In-Stock

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$1.322

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$1.322

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Andel Nordic

Denmark . 1,588 parts In-Stock

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$7.607

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$7.303

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$7.303

1,588

$7.607

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$7.303

$7.303

AZTECH Wire

Italy . 836 parts In-Stock

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$9.832

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836

$9.832

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Parana Technologies

USA . 836 parts In-Stock

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$11.836

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$12.236

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836

$11.836

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$12.236

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DigiPath Technology Company

USA . 1,799 parts In-Stock

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$13.033

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$13.033

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ChromeModa Solutions

Germany . 5,319 parts In-Stock

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$13.299

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$10.905

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$13.299

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IDEA Electronic Components Group

UK . 694 parts In-Stock

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$13.299

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$12.634

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$11.969

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694

$13.299

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$11.969

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One Stop Electronics

USA . 141 parts In-Stock

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$28.000

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$28.000

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Component Stockers USA

USA . 542 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 6,911 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,607 parts In-Stock

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Corphita

USA . 3,056 parts In-Stock

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Microchip USA

USA . 210 parts In-Stock

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the CLVTH16240IDGGREP Bus Driver & Transceivers. This versatile component offers a wide range of applications, providing customers with seamless integration and superior performance. With 4 functions in a compact package, this product delivers unmatched value and benefits to meet your design needs. Trust Texas Instruments for cutting-edge technology and innovative solutions that exceed expectations. Choose the CLVTH16240IDGGREP for your next project and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making this product suitable for rugged environments.

Surface Mount: YES

Surface mount technology offers space-saving benefits and efficient assembly process.

No. of Functions: 4

With 4 functions, this product can handle multiple tasks efficiently.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into various designs and layouts.

No. of Bits: 4

4 bits provide sufficient data processing capabilities for bus driver and transceiver applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a standard supply voltage of 3.3V.

No. of Terminals: 48

With 48 terminals, this product offers versatile connectivity options for different configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact form factor with a small outline and thin profile makes it suitable for space-constrained designs.

Propagation Delay (tpd): 4 ns

Low propagation delay of 4ns ensures fast and efficient signal transmission.

Maximum Operating Temperature: 85 °C

Can operate effectively in high-temperature environments up to 85°C.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state when not actively transmitting.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions down to -40°C.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides corrosion resistance and improves signal conductivity.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting options.

No. of Ports: 2

With 2 ports, this product can handle dual communication channels effectively.

Maximum Seated Height: 1.2 mm

Low seated height makes it suitable for compact designs.

Width: 6.1 mm

Narrow width enables easy integration into tight spaces.

Output Polarity: INVERTED

Inverted output polarity aligns with certain bus communication protocols.

Minimum Supply Voltage (Vsup): 2.7 V

Can operate at a minimum supply voltage of 2.7V, conserving power.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for up to 30 seconds during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C ensures reliability during soldering.

Length: 12.5 mm

Compact length facilitates easy placement on PCBs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance allows for operation in harsh environmental conditions.

Technology: BICMOS

BiCMOS technology combines the advantages of bipolar and CMOS, offering high speed and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form provides secure attachment during assembly.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting on PCBs.

Maximum Supply Voltage (Vsup): 3.6 V

Operates safely within a maximum supply voltage of 3.6V.

Technical Specifications

Bus Driver & Transceivers CLVTH16240IDGGREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

CLVTH16240IDGGREP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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