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CLVTH16245AIDGGRQ1

Texas Instruments

CLVTH16245AIDGGRQ1 by Texas Instruments

CLVTH16245AIDGGRQ1 by Texas Instruments is a bus driver with 3.3 ns propagation delay, suitable for industrial applications. It features 8 bits, operates at 3.3V, and has a load capacitance of 50 pF. This device comes in a small outline package with dual terminals and supports bidirectional control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,475 parts In-Stock

1+ parts

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2,475

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Digiode

USA . 2,385 parts In-Stock

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2,385

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 488 parts In-Stock

1+ parts

$0.226

100+ parts

-

1k+ parts

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$0.217

488

$0.226

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-

$0.217

Northwest PG Solutions

USA . 1,475 parts In-Stock

1+ parts

$0.249

100+ parts

-

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$0.219

1,475

$0.249

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$0.219

Andel Nordic

Denmark . 3,958 parts In-Stock

1+ parts

$7.335

100+ parts

-

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$7.042

10k+ parts

$7.042

3,958

$7.335

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$7.042

$7.042

AZTECH Wire

Italy . 693 parts In-Stock

1+ parts

$7.683

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693

$7.683

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One Stop Electronics

USA . 1,512 parts In-Stock

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$24.000

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1,512

$24.000

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Parana Technologies

USA . 1,406 parts In-Stock

1+ parts

$29.011

100+ parts

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$54.352

10k+ parts

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1,406

$29.011

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$54.352

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ChromeModa Solutions

Germany . 1,933 parts In-Stock

1+ parts

$32.597

100+ parts

$26.730

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1,933

$32.597

$26.730

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IDEA Electronic Components Group

UK . 316 parts In-Stock

1+ parts

$32.597

100+ parts

$30.967

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$29.337

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316

$32.597

$30.967

$29.337

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DigiPath Technology Company

USA . 1,487 parts In-Stock

1+ parts

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100+ parts

$29.389

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1,487

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$29.389

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Corphita

USA . 1,286 parts In-Stock

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1,286

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Overview

Experience top-notch quality and reliability with the Texas Instruments CLVTH16245AIDGGRQ1, a cutting-edge Bus Driver & Transceiver. Manufactured by industry leader Texas Instruments, this product offers unparalleled value and benefits for your applications. With a fast propagation delay, low power consumption, and high operating temperature range, this dual-function device is perfect for a wide range of industrial uses. Upgrade your systems today with the CLVTH16245AIDGGRQ1 and enjoy seamless performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material provides durability and excellent protection for the internal components of the product, making it suitable for rugged environments.

Propagation Delay At Nominal Supply: 3.3 ns

The low propagation delay of 3.3 ns ensures fast data transmission and minimal latency, making this product ideal for high-speed bus driver applications.

No. of Functions: 2

Having 2 functions allows for greater versatility in the product's application, providing more functionality and flexibility in driving and transmitting signals.

Package Shape: RECTANGULAR

The RECTANGULAR package shape is space-efficient and allows for easy integration into circuit designs, making this product suitable for compact electronic assemblies.

Output Characteristics: 3-STATE

The 3-STATE output characteristics offer tristate outputs which can be used to drive a bus with multiple devices, enabling efficient communication and reduced interference.

Technical Specifications

Bus Driver & Transceivers CLVTH16245AIDGGRQ1 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

JESD-30 Code:

R-PDSO-G48

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.3 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Bus Driver/Transceivers

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Trade Compliance

CLVTH16245AIDGGRQ1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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