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CLVTH16245AIDGVREP

Texas Instruments

CLVTH16245AIDGVREP by Texas Instruments

CLVTH16245AIDGVREP by Texas Instruments is a Bus Driver & Transceiver with 3.3 ns Propagation Delay, 8-bit No. of Bits, and 64 Amp Max I (ol). It is ideal for industrial applications requiring bidirectional control with a supply voltage range of 2.7V to 3.6V and operating temperatures from -40°C to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,817 parts In-Stock

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Digiode

USA . 180 parts In-Stock

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180

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Distributors (Availability)

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Native Components

USA . 102 parts In-Stock

1+ parts

$0.255

100+ parts

-

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$0.245

102

$0.255

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$0.245

Northwest PG Solutions

USA . 1,108 parts In-Stock

1+ parts

$0.280

100+ parts

-

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$0.247

1,108

$0.280

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$0.247

Andel Nordic

Denmark . 2,778 parts In-Stock

1+ parts

$2.943

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-

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$2.825

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$2.825

2,778

$2.943

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$2.825

AZTECH Wire

Italy . 300 parts In-Stock

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$13.599

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300

$13.599

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Parana Technologies

USA . 1,935 parts In-Stock

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$21.060

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$21.306

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$21.060

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$21.306

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DigiPath Technology Company

USA . 1,608 parts In-Stock

1+ parts

$23.190

100+ parts

$21.335

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1,608

$23.190

$21.335

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ChromeModa Solutions

Germany . 3,446 parts In-Stock

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$23.663

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$19.404

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$23.663

$19.404

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IDEA Electronic Components Group

UK . 1,935 parts In-Stock

1+ parts

$23.663

100+ parts

$22.480

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$21.297

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1,935

$23.663

$22.480

$21.297

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One Stop Electronics

USA . 867 parts In-Stock

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$41.000

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867

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QUARKTWIN TECHNOLOGY LTD

USA . 8,143 parts In-Stock

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Corphita

USA . 1,311 parts In-Stock

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Microchip USA

USA . 195 parts In-Stock

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Overview

Looking for a reliable Bus Driver & Transceiver that offers exceptional performance and quality? Look no further than the CLVTH16245AIDGVREP by Texas Instruments. With its advanced technology and industrial-grade design, this product ensures efficient data transmission and seamless communication in various applications. Experience the benefits of true output polarity, common control, and 3-state output characteristics, all packed in a compact and durable package. Trust Texas Instruments for top-notch solutions that deliver value and reliability to meet your needs. Elevate your projects with the CLVTH16245AIDGVREP today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 3.3 ns

Low propagation delay ensures fast signal transmission, making this product suitable for high-speed bus driver applications.

Surface Mount: YES

Surface mount packaging allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

No. of Functions: 2

Having multiple functions in a single component saves space on the PCB and simplifies circuit design.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V makes this product compatible with a wide range of systems and applications.

Load Capacitance (CL): 50 pF

With a low load capacitance, this product can drive capacitive loads efficiently without signal degradation.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range (-40°C to 85°C) ensures reliable operation in harsh environmental conditions.

Technology: BICMOS

Using BiCMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers CLVTH16245AIDGVREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

9.7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.3 ns

Propagation Delay (tpd):

3.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

CLVTH16245AIDGVREP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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