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CLVTH16245AIZQLREP

Texas Instruments

CLVTH16245AIZQLREP by Texas Instruments

CLVTH16245AIZQLREP by Texas Instruments is a Bus Driver & Transceiver with 3.3 ns Propagation Delay, 64 Amp Max I (ol), and 85°C Max Operating Temperature. Ideal for industrial applications requiring bidirectional control with a common control type in a compact package style of GRID ARRAY.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,569 parts In-Stock

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5,569

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Digiode

USA . 713 parts In-Stock

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713

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 2,238 parts In-Stock

1+ parts

$1.193

100+ parts

-

1k+ parts

$1.145

10k+ parts

$1.145

2,238

$1.193

-

$1.145

$1.145

AZTECH Wire

Italy . 654 parts In-Stock

1+ parts

$5.794

100+ parts

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654

$5.794

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Parana Technologies

USA . 1,156 parts In-Stock

1+ parts

$17.387

100+ parts

$1,614.650

1k+ parts

$15.648

10k+ parts

-

1,156

$17.387

$1,614.650

$15.648

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DigiPath Technology Company

USA . 2,173 parts In-Stock

1+ parts

$19.145

100+ parts

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2,173

$19.145

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ChromeModa Solutions

Germany . 4,449 parts In-Stock

1+ parts

$19.536

100+ parts

$16.020

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4,449

$19.536

$16.020

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IDEA Electronic Components Group

UK . 1,764 parts In-Stock

1+ parts

$19.536

100+ parts

$18.559

1k+ parts

$17.582

10k+ parts

-

1,764

$19.536

$18.559

$17.582

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One Stop Electronics

USA . 1,131 parts In-Stock

1+ parts

$52.000

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1,131

$52.000

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QUARKTWIN TECHNOLOGY LTD

USA . 27,859 parts In-Stock

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27,859

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Northwest PG Solutions

USA . 1,690 parts In-Stock

1+ parts

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$3.468

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1,690

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$3.468

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Microchip USA

USA . 1,437 parts In-Stock

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1,437

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Native Components

USA . 752 parts In-Stock

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$3.433

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752

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$3.433

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Corphita

USA . 719 parts In-Stock

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719

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Overview

Enhance your electronic designs with the CLVTH16245AIZQLREP by Texas Instruments, a top-tier bus driver & transceiver perfect for various applications. Crafted with precision and quality materials, this product boasts a quick propagation delay of 3.3 ns and a wide operating temperature range. With its advanced technology and reliable performance, customers can expect seamless integration and optimal functionality in their projects. Trust Texas Instruments to deliver excellence in every component, providing you with the tools needed to bring your ideas to life. Upgrade your systems today with the CLVTH16245AIZQLREP and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver and transceiver, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 3.3 ns

Low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed communication applications.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 2

Offers multiple functions in a single component, saving space on the circuit board and reducing overall system complexity.

Package Shape: RECTANGULAR

Compact rectangular shape makes it easy to integrate into existing circuit designs, optimizing space utilization.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard 3.3V power supplies, ensuring seamless integration into various electronic systems.

Load Capacitance (CL): 50 pF

Suitable for driving capacitive loads of up to 50 pF, making it versatile for different types of communication applications.

Power Supplies (V): 3.3

Operates efficiently with a 3.3V power supply, ensuring optimal performance and reliability.

No. of Terminals: 56

Provides ample connectivity options for interfacing with other electronic components, enhancing the versatility of the product.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Compact and thin profile design with a fine pitch layout allows for high-density mounting on circuit boards, enabling space-saving and efficient PCB layouts.

Maximum I (ol): 64 Amp

High maximum output current allows for driving power-hungry loads, making this product suitable for demanding applications.

Propagation Delay (tpd): 3.7 ns

Low propagation delay ensures fast response times, enabling efficient data transmission with minimal delay.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions, making this product suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output allows for high-impedance state when not actively driving the bus, reducing power consumption and minimizing signal interference.

Minimum Operating Temperature: -40 °C

Provides reliable operation in extreme cold temperatures, ensuring consistent performance in harsh environments.

Terminal Finish: TIN SILVER COPPER

Durable terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability of the product.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB mounting and soldering, simplifying the assembly process.

No. of Ports: 2

Dual ports offer versatile connectivity options for interfacing with multiple devices, enhancing the flexibility of the product.

Maximum Seated Height: 1 mm

Low-profile design with a maximum seated height of 1mm allows for space-efficient PCB layouts, ideal for compact electronic designs.

Width: 4.5 mm

Narrow width minimizes space requirements on the PCB, enabling efficient utilization of board space in tight layouts.

Output Polarity: TRUE

True output polarity ensures correct signal alignment, preventing errors in data transmission and ensuring accurate communication.

Minimum Supply Voltage (Vsup): 2.7 V

Low minimum supply voltage allows for operation in low-power scenarios, making this product energy-efficient and versatile.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient assembly during solder reflow processes, ensuring proper solder joint formation and reliable connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures compatibility with standard lead-free soldering processes, making this product suitable for RoHS-compliant applications.

Length: 7 mm

Compact length minimizes space requirements on the PCB, enabling efficient board layout designs in confined spaces.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making this product suitable for industrial applications.

Technology: BICMOS

Utilizes BiCMOS technology for high-speed performance and low power consumption, making this product ideal for high-performance communication applications.

Terminal Form: BALL

Ball terminal form allows for easy soldering and reliable connections, ensuring stable operation in demanding applications.

Packing Method: TR

Tray packaging method provides secure and organized storage for the product, ensuring protection during transportation and storage.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm enables high-density mounting on PCBs, facilitating compact and space-efficient electronic designs.

Count Direction: BIDIRECTIONAL

Bidirectional count direction allows for data transmission in both directions, enhancing flexibility and compatibility with various communication protocols.

Control Type: COMMON CONTROL

Common control interface simplifies system integration and operation, allowing for easy control of the bus driver and transceiver functions.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage tolerance provides flexibility in power supply options, accommodating a wide range of voltage inputs for versatile application scenarios.

Technical Specifications

Bus Driver & Transceivers CLVTH16245AIZQLREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PBGA-B56

JESD-609 Code:

e1

Length:

7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.3 ns

Propagation Delay (tpd):

3.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.5 mm

Trade Compliance

CLVTH16245AIZQLREP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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