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CLVTH16244AMDGGREP

Texas Instruments

CLVTH16244AMDGGREP by Texas Instruments

CLVTH16244AMDGGREP by Texas Instruments is a 4-bit bus driver with 4.4ns propagation delay, suitable for military-grade applications. It features a 3.3V nominal voltage, 48 terminals in a small outline package, and supports true output polarity. Ideal for high-speed communication systems requiring low power consumption and reliable signal transmission.

Median Price

$4.396

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 45,618 parts In-Stock

1+ parts

$3.272

100+ parts

$2.867

1k+ parts

$1.620

10k+ parts

-

45,618

$3.272

$2.867

$1.620

-

Mouser Electronics

USA . 1,346 parts In-Stock

1+ parts

$5.520

100+ parts

$3.540

1k+ parts

$3.230

10k+ parts

$3.090

1,346

$5.520

$3.540

$3.230

$3.090

DigiKey

USA . 1,271 parts In-Stock

1+ parts

$5.520

100+ parts

$3.535

1k+ parts

$3.493

10k+ parts

$3.108

1,271

$5.520

$3.535

$3.493

$3.108

Verical

USA . 242 parts In-Stock

1+ parts

-

100+ parts

$0.573

1k+ parts

-

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242

-

$0.573

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,876 parts In-Stock

1+ parts

$0.573

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-

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3,876

$0.573

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Digiode

USA . 1,162 parts In-Stock

1+ parts

$3.108

100+ parts

-

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1,162

$3.108

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North Shore Components

USA . 3,003 parts In-Stock

1+ parts

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3,003

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QIE Inc.

USA . 25 parts In-Stock

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25

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Prism Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 577 parts In-Stock

1+ parts

$0.448

100+ parts

-

1k+ parts

-

10k+ parts

$0.430

577

$0.448

-

-

$0.430

Ampacity Inc.

Singapore . 12,172 parts In-Stock

1+ parts

$0.487

100+ parts

-

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12,172

$0.487

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-

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Northwest PG Solutions

USA . 528 parts In-Stock

1+ parts

$0.493

100+ parts

-

1k+ parts

-

10k+ parts

$0.435

528

$0.493

-

-

$0.435

Corphita

USA . 92 parts In-Stock

1+ parts

$2.945

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92

$2.945

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Parana Technologies

USA . 1,851 parts In-Stock

1+ parts

$26.345

100+ parts

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1k+ parts

$26.943

10k+ parts

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1,851

$26.345

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$26.943

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DigiPath Technology Company

USA . 2,324 parts In-Stock

1+ parts

$29.009

100+ parts

$26.688

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2,324

$29.009

$26.688

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ChromeModa Solutions

Germany . 4,354 parts In-Stock

1+ parts

$29.601

100+ parts

$24.273

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4,354

$29.601

$24.273

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IDEA Electronic Components Group

UK . 203 parts In-Stock

1+ parts

$29.601

100+ parts

$28.121

1k+ parts

$26.641

10k+ parts

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203

$29.601

$28.121

$26.641

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Perfect Parts

USA . 10,089 parts In-Stock

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10,089

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Lixinc

USA . 7,157 parts In-Stock

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7,157

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A-Z Elektronik GmbH

Germany . 5,129 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,419 parts In-Stock

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3,419

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Kepictronics

USA . 2,130 parts In-Stock

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2,130

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Overview

Elevate your electronic designs with the CLVTH16244AMDGGREP by Texas Instruments, a top-tier manufacturer known for delivering quality bus drivers & transceivers. This versatile component offers fast propagation delay and 3-state output characteristics, making it ideal for a wide range of applications. With a compact rectangular package design and dual terminal position, this product provides exceptional value and reliability for your projects. Upgrade your systems today with the trusted technology of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that provides good protection for the internal components of the bus driver/transceiver.

Propagation Delay At Nominal Supply: 4.4 ns

Fast signal transmission speed ensures efficient communication within the system.

Surface Mount: YES

Ease of installation and space-saving design for compact electronic devices.

No. of Functions: 4

Versatile device capable of performing multiple functions efficiently.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common power supply voltages, making it easy to integrate into existing systems.

Output Characteristics: 3-STATE

Ability to drive the output to a high-impedance state when not actively transmitting signals, reducing power consumption and signal interference.

Technology: BICMOS

Combination of bipolar and CMOS technology for high-performance and low-power consumption operation.

Maximum Operating Temperature: 125 °C

Suitable for use in extreme temperature conditions, making it reliable in various environments.

Technical Specifications

Bus Driver & Transceivers CLVTH16244AMDGGREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

4.4 ns

Propagation Delay (tpd):

4.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

6.1 mm

Trade Compliance

CLVTH16244AMDGGREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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