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CLVTH16244AIDGVREP

Texas Instruments

CLVTH16244AIDGVREP by Texas Instruments

The Texas Instruments CLVTH16244AIDGVREP is a 4-bit bus driver with a propagation delay of 3.2 ns at 3.3V, suitable for industrial applications. It features a max operating temperature of 85°C, output polarity TRUE, and GULL WING terminal form.

Median Price

$3.454

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 18,647 parts In-Stock

1+ parts

$3.454

100+ parts

$3.027

1k+ parts

$1.710

10k+ parts

-

18,647

$3.454

$3.027

$1.710

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 2,857 parts In-Stock

1+ parts

$1.751

100+ parts

$1.839

1k+ parts

$1.734

10k+ parts

-

2,857

$1.751

$1.839

$1.734

-

Digiode

USA . 105 parts In-Stock

1+ parts

$3.281

100+ parts

-

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-

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105

$3.281

-

-

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Vyrian

USA . 3,694 parts In-Stock

1+ parts

-

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-

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3,694

-

-

-

-

4 Star Electronics, Inc.

USA . 1 parts In-Stock

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-

100+ parts

-

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1

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 963 parts In-Stock

1+ parts

$0.151

100+ parts

-

1k+ parts

-

10k+ parts

$0.145

963

$0.151

-

-

$0.145

Northwest PG Solutions

USA . 958 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

$0.146

958

$0.166

-

-

$0.146

Corphita

USA . 1,195 parts In-Stock

1+ parts

$3.109

100+ parts

-

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1,195

$3.109

-

-

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Andel Nordic

Denmark . 3,660 parts In-Stock

1+ parts

$7.917

100+ parts

-

1k+ parts

$7.600

10k+ parts

$7.600

3,660

$7.917

-

$7.600

$7.600

Parana Technologies

USA . 1,596 parts In-Stock

1+ parts

$13.400

100+ parts

-

1k+ parts

$13.916

10k+ parts

-

1,596

$13.400

-

$13.916

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DigiPath Technology Company

USA . 1,745 parts In-Stock

1+ parts

$14.755

100+ parts

-

1k+ parts

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10k+ parts

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1,745

$14.755

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-

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ChromeModa Solutions

Germany . 1,120 parts In-Stock

1+ parts

$15.056

100+ parts

$12.346

1k+ parts

-

10k+ parts

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1,120

$15.056

$12.346

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IDEA Electronic Components Group

UK . 959 parts In-Stock

1+ parts

$15.056

100+ parts

$14.303

1k+ parts

$13.550

10k+ parts

-

959

$15.056

$14.303

$13.550

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AZTECH Wire

Italy . 625 parts In-Stock

1+ parts

$16.230

100+ parts

-

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625

$16.230

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A-Z Elektronik GmbH

Germany . 5,894 parts In-Stock

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5,894

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Alle Elektronik GmbH

Germany . 3,929 parts In-Stock

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3,929

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Overview

Upgrade your electronics with the CLVTH16244AIDGVREP by Texas Instruments, a top-tier manufacturer in the industry. This Bus Driver & Transceiver offers unmatched quality and reliability for a wide range of applications. With its advanced technology and industrial-grade temperature grade, this product ensures optimal performance in any environment. Experience fast propagation delay, low power consumption, and true output polarity, providing exceptional value and benefits to customers looking for high-quality components. Trust Texas Instruments for cutting-edge solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Propagation Delay At Nominal Supply: 3.2 ns

The low propagation delay ensures fast data transmission, making the product suitable for high-speed applications.

Surface Mount: YES

The surface mount capability allows for easy installation and space-saving on PCBs.

No. of Functions: 4

Having multiple functions in one component reduces the need for additional components, simplifying the circuit design.

Load Capacitance (CL): 50 pF

The low load capacitance helps in reducing signal distortion and improving signal integrity.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers CLVTH16244AIDGVREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

9.7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

5 mA

Propagation Delay At Nominal Supply:

3.2 ns

Propagation Delay (tpd):

3.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

CLVTH16244AIDGVREP Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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