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CLVTH16245AIGQLREP

Texas Instruments

CLVTH16245AIGQLREP by Texas Instruments

CLVTH16245AIGQLREP by Texas Instruments is a Bus Driver & Transceiver with 3.3 ns Propagation Delay, 8-bit No. of Bits, and 64 Amp Max I (ol). It is ideal for industrial applications requiring bidirectional control with a supply voltage range of 2.7V to 3.6V and operating temperatures from -40°C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,945 parts In-Stock

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Digiode

USA . 2,464 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 3,284 parts In-Stock

1+ parts

$7.038

100+ parts

-

1k+ parts

$6.757

10k+ parts

$6.757

3,284

$7.038

-

$6.757

$6.757

AZTECH Wire

Italy . 514 parts In-Stock

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$13.885

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514

$13.885

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Parana Technologies

USA . 432 parts In-Stock

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$15.013

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$1,394.223

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$13.512

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432

$15.013

$1,394.223

$13.512

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DigiPath Technology Company

USA . 1,481 parts In-Stock

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$16.532

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$16.532

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ChromeModa Solutions

Germany . 6,734 parts In-Stock

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$16.869

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$13.833

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6,734

$16.869

$13.833

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IDEA Electronic Components Group

UK . 862 parts In-Stock

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$16.869

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$16.026

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$15.182

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862

$16.869

$16.026

$15.182

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One Stop Electronics

USA . 389 parts In-Stock

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$30.000

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Corphita

USA . 4,182 parts In-Stock

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Native Components

USA . 885 parts In-Stock

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Northwest PG Solutions

USA . 509 parts In-Stock

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Microchip USA

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Overview

Elevate your electronics projects with the CLVTH16245AIGQLREP from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This bus driver and transceiver is perfect for a wide range of applications, offering a seamless experience for customers. With fast propagation delay, low power consumption, and versatile mounting options, this product provides exceptional value and benefits. Upgrade your designs today with the CLVTH16245AIGQLREP and experience the difference in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in buses where weight and reliability are important factors.

Propagation Delay At Nominal Supply: 3.3 ns

With a low propagation delay, this product ensures fast communication and response time in bus driver applications, improving overall efficiency.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB, making it a convenient choice for bus driver applications.

No. of Functions: 2

Having 2 functions in one component simplifies the design and reduces the number of components needed, leading to cost-effectiveness and easier maintenance.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB, making it easier to integrate into bus driver systems with limited space.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard 3.3V supply voltage, this product is compatible with a wide range of bus driver systems and ensures reliable performance.

Load Capacitance (CL): 50 pF

The low load capacitance helps in maintaining signal integrity and minimizing signal distortion in bus driver applications, resulting in reliable data transmission.

Power Supplies (V): 3.3

Having power supplies at 3.3V simplifies the power management system and ensures compatibility with other components in the bus driver setup.

No. of Terminals: 56

With a high number of terminals, this product offers flexibility in connection options and enables multiple functionalities to be integrated into the bus driver system.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array style with a thin profile and fine pitch enables high-density packaging and efficient use of space on the PCB, making it suitable for compact bus driver systems.

Maximum I (ol): 64 Amp

The high output current capability of 64A allows this product to drive heavy loads efficiently, making it suitable for bus driver applications that require high power outputs.

Propagation Delay (tpd): 3.7 ns

With a low propagation delay of 3.7ns, this product ensures fast signal transmission and response time, enhancing the overall performance of bus driver systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the product's reliability and allows it to withstand harsh environmental conditions in bus driver applications.

Output Characteristics: 3-STATE

The 3-state output characteristic provides flexibility in controlling the output signal, allowing the product to be used in a variety of bus driver applications with different signal requirements.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the product's reliability and performance even in cold climates or extreme temperature conditions commonly found in bus driver systems.

Terminal Position: BOTTOM

Having terminals at the bottom simplifies the soldering process and allows for easy connection in bus driver systems where space may be limited for terminal access.

No. of Ports: 2

With 2 ports, this product supports bidirectional communication and provides flexibility in connecting to other devices in the bus driver network, enhancing the overall system's functionality.

Maximum Seated Height: 1 mm

With a low maximum seated height of 1mm, this product offers a compact form factor suitable for space-constrained bus driver systems and allows for efficient PCB layout.

Width: 4.5 mm

Having a narrow width of 4.5mm enables easy integration into bus driver systems with limited space on the PCB, making it a convenient choice for compact designs.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and reception in bus driver applications, reducing the risk of signal errors and improving system reliability.

Minimum Supply Voltage (Vsup): 2.7 V

With a low minimum supply voltage of 2.7V, this product can operate efficiently even at low power levels, making it suitable for energy-efficient bus driver systems.

Length: 7 mm

The compact length of 7mm makes this product suitable for space-constrained bus driver systems, allowing for a more efficient use of space on the PCB.

Temperature Grade: INDUSTRIAL

Being designed for industrial temperature ranges, this product can operate reliably in harsh environmental conditions commonly encountered in bus driver applications, ensuring long-term performance and durability.

Technology: BICMOS

Utilizing BICMOS technology ensures high-speed operation and efficient power consumption, making this product a reliable and energy-efficient choice for bus driver applications.

Terminal Form: BALL

Having ball terminals simplifies the soldering process and ensures reliable connections in bus driver systems, improving the overall durability and performance of the product.

Packing Method: TR

The TR packing method ensures the product is securely packaged and protected during transportation and storage, reducing the risk of damage and ensuring product quality upon receipt.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density packaging and efficient use of space on the PCB, making this product suitable for compact bus driver systems.

Count Direction: BIDIRECTIONAL

Supporting bidirectional communication, this product allows for simultaneous transmission and reception of data in bus driver systems, enhancing the overall efficiency and performance of the system.

Control Type: COMMON CONTROL

Featuring common control functionality, this product simplifies the control process in bus driver systems by providing a centralized mechanism for managing multiple functions, leading to easier operation and maintenance.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this product offers a wide operating range and ensures compatibility with different power sources in bus driver applications, providing versatility and flexibility in system design.

Technical Specifications

Bus Driver & Transceivers CLVTH16245AIGQLREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

LVT

JESD-30 Code:

R-PBGA-B56

Length:

7 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA56,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.3 ns

Propagation Delay (tpd):

3.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

4.5 mm

Trade Compliance

CLVTH16245AIGQLREP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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