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CD4063BMT

Texas Instruments

CD4063BMT by Texas Instruments

CD4063BMT by Texas Instruments is a 4-bit digital arithmetic circuit with 500 ns propagation delay at 5V. It operates in a temperature range of -55 to 125°C, suitable for military applications. With a small outline package style and surface mount capability, it offers true output polarity and low power consumption.

Median Price

$0.766

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 833 parts In-Stock

1+ parts

-

100+ parts

$0.739

1k+ parts

$0.613

10k+ parts

$0.546

833

-

$0.739

$0.613

$0.546

DigiKey

USA . 833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.920

10k+ parts

-

833

-

-

$0.920

-

Verical

USA . 833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.766

10k+ parts

$0.683

833

-

-

$0.766

$0.683

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,444 parts In-Stock

1+ parts

$0.461

100+ parts

-

1k+ parts

-

10k+ parts

-

2,444

$0.461

-

-

-

Vyrian

USA . 2,792 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,792

-

-

-

-

DigiKey Marketplace

USA . 833 parts In-Stock

1+ parts

-

100+ parts

$0.440

1k+ parts

-

10k+ parts

-

833

-

$0.440

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,153 parts In-Stock

1+ parts

$0.436

100+ parts

-

1k+ parts

-

10k+ parts

-

4,153

$0.436

-

-

-

Microchip USA

USA . 1,071 parts In-Stock

1+ parts

$3.140

100+ parts

$3.120

1k+ parts

$3.110

10k+ parts

$3.100

1,071

$3.140

$3.120

$3.110

$3.100

Andel Nordic

Denmark . 2,048 parts In-Stock

1+ parts

$7.637

100+ parts

-

1k+ parts

$7.331

10k+ parts

$7.331

2,048

$7.637

-

$7.331

$7.331

Native Components

USA . 716 parts In-Stock

1+ parts

$17.925

100+ parts

-

1k+ parts

-

10k+ parts

-

716

$17.925

-

-

-

Northwest PG Solutions

USA . 1,726 parts In-Stock

1+ parts

$19.717

100+ parts

$17.746

1k+ parts

-

10k+ parts

-

1,726

$19.717

$17.746

-

-

Parana Technologies

USA . 1,276 parts In-Stock

1+ parts

$21.641

100+ parts

-

1k+ parts

$22.055

10k+ parts

-

1,276

$21.641

-

$22.055

-

DigiPath Technology Company

USA . 939 parts In-Stock

1+ parts

$23.830

100+ parts

$21.923

1k+ parts

-

10k+ parts

-

939

$23.830

$21.923

-

-

ChromeModa Solutions

Germany . 4,113 parts In-Stock

1+ parts

$24.316

100+ parts

$19.939

1k+ parts

-

10k+ parts

-

4,113

$24.316

$19.939

-

-

IDEA Electronic Components Group

UK . 2,222 parts In-Stock

1+ parts

$24.316

100+ parts

$23.100

1k+ parts

$21.884

10k+ parts

-

2,222

$24.316

$23.100

$21.884

-

Overview

Boost your digital arithmetic circuits with the CD4063BMT by Texas Instruments, a top-quality product that guarantees reliability and precision in your applications. Manufactured by the industry leader, Texas Instruments, this product offers exceptional value and benefits to customers looking for high-performance solutions. With a compact design and advanced technology, the CD4063BMT is perfect for a wide range of applications. Upgrade your projects today with the unmatched quality and advantages of Texas Instruments' CD4063BMT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for a variety of applications without adding unnecessary weight.

Propagation Delay At Nominal Supply: 500 ns

The low propagation delay ensures fast and efficient operation of the digital arithmetic circuits.

Surface Mount: YES

Surface mount technology allows for easy and secure placement on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration with other components straightforward and compatible with common power sources.

Power Supplies (V): 5/15

Supporting multiple power supply options enables flexibility in designing and adapting the product to different system requirements.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and performance under various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and robust operation.

Technical Specifications

Digital Arithmetic Circuits CD4063BMT attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CASCADABLE

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Maximum Power Supply Current (ICC):

.3 mA

Propagation Delay At Nominal Supply:

500 ns

Propagation Delay (tpd):

1250 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD4063BMT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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