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CC430F6126IRGCR

Texas Instruments

CC430F6126IRGCR by Texas Instruments

CC430F6126IRGCR by Texas Instruments is a telecom IC with 64 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 2.2V and data rate of 0.25 Mbps. Ideal for industrial applications requiring low-profile surface mount components.

Median Price

$5.170

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,930 parts In-Stock

1+ parts

$5.170

100+ parts

$4.215

1k+ parts

$2.810

10k+ parts

-

5,930

$5.170

$4.215

$2.810

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,623 parts In-Stock

1+ parts

$4.912

100+ parts

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2,623

$4.912

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Vyrian

USA . 6,383 parts In-Stock

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6,383

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Component Sense

UK . 5,010 parts In-Stock

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5,010

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Chip Stock

USA . 3,600 parts In-Stock

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3,600

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Cyclops Electronics Ltd

UK . 1,990 parts In-Stock

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1,990

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ComSIT Distribution GmbH

Germany . 316 parts In-Stock

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316

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Distributors (Availability)

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Native Components

USA . 337 parts In-Stock

1+ parts

$2.004

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337

$2.004

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Northwest PG Solutions

USA . 498 parts In-Stock

1+ parts

$2.205

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498

$2.205

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Corphita

USA . 1,631 parts In-Stock

1+ parts

$4.653

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1,631

$4.653

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AZTECH Wire

Italy . 894 parts In-Stock

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$11.890

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894

$11.890

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Parana Technologies

USA . 441 parts In-Stock

1+ parts

$13.955

100+ parts

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$14.431

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441

$13.955

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$14.431

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DigiPath Technology Company

USA . 2,285 parts In-Stock

1+ parts

$15.366

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2,285

$15.366

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ChromeModa Solutions

Germany . 3,528 parts In-Stock

1+ parts

$15.680

100+ parts

$12.858

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3,528

$15.680

$12.858

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IDEA Electronic Components Group

UK . 235 parts In-Stock

1+ parts

$15.680

100+ parts

$14.896

1k+ parts

$14.112

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235

$15.680

$14.896

$14.112

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Lixinc

USA . 10,173 parts In-Stock

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Kepictronics

USA . 2,500 parts In-Stock

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2,500

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Futuretech Components

Singapore . 2,000 parts In-Stock

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2,000

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A-Z Elektronik GmbH

Germany . 2,000 parts In-Stock

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2,000

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GreenTree Electronics

Israel . 1,990 parts In-Stock

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1,990

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Experience the cutting-edge technology of the CC430F6126IRGCR by Texas Instruments, a top-tier manufacturer known for quality and reliability. This telecom interface IC offers unparalleled performance in various applications, providing customers with seamless connectivity and unmatched efficiency. With a wide range of benefits such as low power consumption and high data rates, this product is a game-changer in the industry. Trust Texas Instruments to deliver value and innovation with every use of the CC430F6126IRGCR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material ensures durability and reliability of the product, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy installation and maintenance of the product, saving time and effort.

Package Shape: SQUARE

Square package shape provides a compact form factor, saving valuable space on the PCB.

No. of Terminals: 64

Having 64 terminals allows for more connectivity options and flexibility in designing the circuit.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier with a very thin profile allows for high-density mounting and efficient heat dissipation.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can operate in cold environments without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

Multiple terminal finish options provide excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: QUAD

Quad terminal position allows for easy soldering and connection, reducing assembly time.

Maximum Seated Height: 1 mm

Low seated height saves space and allows for compact design of the circuit.

Width: 9 mm

Narrow width makes it easy to fit the product in tight spaces on the PCB.

Maximum Time At Peak Reflow Temperature (s): 30

Short time at peak reflow temperature reduces the risk of thermal stress and damage during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability of the connections.

Length: 9 mm

Compact length allows for efficient use of space on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures the product can withstand harsh operating conditions.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and ensures safety during handling and disposal.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimized performance and compatibility.

Nominal Supply Voltage: 2.2 V

Low nominal supply voltage helps in reducing power consumption and heat dissipation.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and more connectivity options on the PCB.

Data Rate: 0.25 Mbps

Decent data rate of 0.25 Mbps makes the product suitable for various telecom applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates the level of protection against moisture, ensuring reliability in humid environments.

Technical Specifications

Other Function Telecom Interface ICs CC430F6126IRGCR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

.25 Mbps

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

CC430F6126IRGCR Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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