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AM5729BABCX

Texas Instruments

AM5729BABCX by Texas Instruments

AM5729BABCX by Texas Instruments is a microprocessor with 32-bit external data bus width, 16-bit address bus width, and max clock frequency of 32 MHz. It is used in applications requiring low power mode, such as embedded systems and IoT devices.

Median Price

$98.260

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 575 parts In-Stock

1+ parts

$70.478

100+ parts

$62.647

1k+ parts

$46.064

10k+ parts

-

575

$70.478

$62.647

$46.064

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DigiKey

USA . 679 parts In-Stock

1+ parts

$98.260

100+ parts

$75.271

1k+ parts

$73.386

10k+ parts

-

679

$98.260

$75.271

$73.386

-

Mouser Electronics

USA . 120 parts In-Stock

1+ parts

$98.260

100+ parts

$74.250

1k+ parts

-

10k+ parts

-

120

$98.260

$74.250

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,132 parts In-Stock

1+ parts

$54.834

100+ parts

-

1k+ parts

-

10k+ parts

-

4,132

$54.834

-

-

-

Vyrian

USA . 3,055 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,055

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 90 parts In-Stock

1+ parts

$2.552

100+ parts

-

1k+ parts

-

10k+ parts

-

90

$2.552

-

-

-

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$49.349

100+ parts

$44.908

1k+ parts

$40.466

10k+ parts

-

3,000

$49.349

$44.908

$40.466

-

Corphita

USA . 957 parts In-Stock

1+ parts

$51.948

100+ parts

-

1k+ parts

-

10k+ parts

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957

$51.948

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-

-

Parana Technologies

USA . 318 parts In-Stock

1+ parts

$54.646

100+ parts

-

1k+ parts

-

10k+ parts

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318

$54.646

-

-

-

Corohmni

South Africa . 254 parts In-Stock

1+ parts

$57.748

100+ parts

-

1k+ parts

-

10k+ parts

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254

$57.748

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-

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DigiPath Technology Company

USA . 692 parts In-Stock

1+ parts

$60.172

100+ parts

-

1k+ parts

-

10k+ parts

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692

$60.172

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-

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ChromeModa Solutions

Germany . 5,105 parts In-Stock

1+ parts

$61.400

100+ parts

$50.348

1k+ parts

-

10k+ parts

-

5,105

$61.400

$50.348

-

-

IDEA Electronic Components Group

UK . 1,308 parts In-Stock

1+ parts

$61.400

100+ parts

$58.330

1k+ parts

$55.260

10k+ parts

-

1,308

$61.400

$58.330

$55.260

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Microchip USA

USA . 2,169 parts In-Stock

1+ parts

$119.850

100+ parts

$117.760

1k+ parts

$116.720

10k+ parts

$115.680

2,169

$119.850

$117.760

$116.720

$115.680

Native Components

USA . 779 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.250

10k+ parts

-

779

-

-

$2.250

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Overview

Experience the unbeatable quality and reliability of Texas Instruments with the AM5729BABCX microprocessor. Designed for a wide range of applications, this powerful component offers customers exceptional value and benefits. With cutting-edge technology and top-notch performance, the AM5729BABCX is the perfect choice for your next project. Trust in Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers a good balance of durability and cost-effectiveness for the microprocessor.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.2 V

Operates efficiently within a safe voltage range, ensuring longevity and reliability.

Address Bus Width: 16

Provides ample addressing capabilities for handling large amounts of data efficiently.

No. of Terminals: 760

Offers versatile connectivity options for interfacing with other components in a complex system.

Package Style: GRID ARRAY, FINE PITCH

Facilitates a compact design layout and optimal signal propagation for improved performance.

Minimum Operating Temperature: 0 °C

Can function reliably in varying environmental conditions, making it suitable for a wide range of applications.

Technology: CMOS

Utilizes low power consumption and offers fast processing speeds, making it energy-efficient and high-performing.

External Data Bus Width: 32

Enables efficient data transfer between the microprocessor and external devices, enhancing overall system performance.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture allows for simplified instruction execution and faster processing speeds, improving overall system efficiency.

Technical Specifications

Microprocessors AM5729BABCX attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Additional Features:

ALSO HAVING 16-BIT ADDRESS AND 32-BIT DATA BUS OF EMIF2

Address Bus Width:

16

Boundary Scan:

YES

Maximum Clock Frequency:

32 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B760

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

760

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA760,28X28,31

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

Maximum Seated Height:

2.96 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

1.11 V

Nominal Supply Voltage:

1.15 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

AM5729BABCX Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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