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AM3715CUS

Texas Instruments

AM3715CUS by Texas Instruments

AM3715CUS by Texas Instruments is a 32-bit microprocessor with 26-bit address bus width and 8-bit on-chip data RAM. It operates at a max clock frequency of 54 MHz, suitable for low power mode applications in various electronic devices. The package style is grid array, low profile, fine pitch with terminal finish of Sn/Ag/Cu.

Median Price

$30.744

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 452 parts In-Stock

1+ parts

$30.744

100+ parts

$27.328

1k+ parts

$20.094

10k+ parts

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452

$30.744

$27.328

$20.094

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Mouser Electronics

USA . 1 parts In-Stock

1+ parts

$45.570

100+ parts

$33.080

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1

$45.570

$33.080

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Rochester

USA . 12 parts In-Stock

1+ parts

-

100+ parts

$28.890

1k+ parts

$25.850

10k+ parts

$24.330

12

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$28.890

$25.850

$24.330

DigiKey

USA . 12 parts In-Stock

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12

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Distributors (In-Stock)

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Bristol Electronics

USA . 900 parts In-Stock

1+ parts

$26.400

100+ parts

$23.353

1k+ parts

$21.648

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900

$26.400

$23.353

$21.648

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Digiode

USA . 3,907 parts In-Stock

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$26.514

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3,907

$26.514

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Vyrian

USA . 2,829 parts In-Stock

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2,829

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DigiKey Marketplace

USA . 12 parts In-Stock

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12

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 662 parts In-Stock

1+ parts

$1.045

100+ parts

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662

$1.045

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Northwest PG Solutions

USA . 77 parts In-Stock

1+ parts

$1.150

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77

$1.150

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Corphita

USA . 2,686 parts In-Stock

1+ parts

$25.119

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2,686

$25.119

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Parana Technologies

USA . 1,640 parts In-Stock

1+ parts

$39.732

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1,640

$39.732

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ChromeModa Solutions

Germany . 2,318 parts In-Stock

1+ parts

$44.643

100+ parts

$36.607

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2,318

$44.643

$36.607

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IDEA Electronic Components Group

UK . 1,413 parts In-Stock

1+ parts

$44.643

100+ parts

$42.411

1k+ parts

$40.179

10k+ parts

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1,413

$44.643

$42.411

$40.179

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Kepictronics

USA . 2,000 parts In-Stock

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DigiPath Technology Company

USA . 137 parts In-Stock

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$40.250

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137

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$40.250

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Overview

Experience cutting-edge technology with the AM3715CUS microprocessor by Texas Instruments. Manufactured with precision and expertise, this powerful device offers integrated cache, low power mode, and a wide range of applications in various industries. With a maximum clock frequency of 54 MHz, this product delivers exceptional performance and efficiency. Trust Texas Instruments to provide you with top-quality microprocessors that exceed your expectations, unlocking endless possibilities for your projects. Elevate your designs with the AM3715CUS and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good durability and can handle high temperatures, making the product reliable and long-lasting.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing memory access time and speeding up processing tasks.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the microprocessor on circuit boards, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.2 V

Operating within a maximum supply voltage of 1.2 V ensures efficient power usage and prevents overheating, enhancing the overall performance and longevity of the product.

On Chip Data RAM Width: 8

Having a wide data RAM width of 8 allows for efficient data processing and storage, enabling the microprocessor to handle complex calculations and tasks effectively.

Address Bus Width: 26

With a wide address bus width of 26, the microprocessor can access and manage a large memory space efficiently, facilitating seamless data operations and multitasking capabilities.

Package Shape: SQUARE

A square package shape provides a compact design, making it easier to integrate the microprocessor into various electronic devices and systems while optimizing space usage.

Bit Size: 32

A 32-bit architecture allows for high-speed processing and handling of data, enhancing the overall performance and responsiveness of the microprocessor for diverse applications.

Power Supplies (V): 1.1, 1.8

Supporting multiple power supply options of 1.1 V and 1.8 V enables flexibility in power management, catering to different power requirements for various applications.

No. of Terminals: 423

Having 423 terminals provides a robust interface for connecting the microprocessor to other components and peripherals, ensuring reliable data transmission and communication.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers a space-efficient and reliable mounting solution, enhancing the overall performance and durability of the microprocessor.

Minimum Supply Voltage: 0.9 V

Operating within a minimum supply voltage of 0.9 V ensures power efficiency and extends the battery life of portable devices, making the microprocessor an energy-efficient choice.

Maximum Operating Temperature: 90 °C

With a maximum operating temperature of 90°C, the microprocessor can withstand high temperatures and operate reliably in challenging environmental conditions, ensuring consistent performance.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C allows the microprocessor to function in low-temperature environments, making it suitable for a wide range of applications and industries.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance, ensuring stable connections and optimal performance of the microprocessor.

Terminal Position: BOTTOM

Having terminals positioned at the bottom facilitates easy and secure mounting of the microprocessor onto circuit boards, enhancing reliability and ease of assembly.

Maximum Seated Height: 1.4 mm

With a maximum seated height of 1.4 mm, the microprocessor offers a slim profile, making it suitable for compact electronic devices and systems without compromising performance.

RAM Words: 65536

Featuring a high number of RAM words (65536) enables the microprocessor to handle large amounts of data efficiently, supporting complex computing tasks and applications.

Width: 16 mm

With a width of 16 mm, the microprocessor can be easily integrated into compact devices and systems, offering high performance and functionality in a space-efficient design.

Boundary Scan: YES

Having boundary scan capabilities allows for efficient testing and debugging of the microprocessor during production and maintenance, ensuring quality control and reliability.

External Data Bus Width: 16

An external data bus width of 16 enables fast data transfer between the microprocessor and external components, enhancing system performance and responsiveness.

Maximum Clock Frequency: 54 MHz

Operating at a maximum clock frequency of 54 MHz enables high-speed processing and data transfer, making the microprocessor suitable for demanding computational tasks and applications.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, the microprocessor can withstand high-temperature soldering processes during assembly, ensuring reliable connections and performance.

Length: 16 mm

Measuring 16 mm in length, the microprocessor offers a compact form factor, allowing for easy integration into diverse electronic devices and systems while maintaining high performance.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor enhances the efficiency and speed of processing tasks, making it ideal for applications that require high performance and low power consumption.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, high noise immunity, and fast switching speeds, making the microprocessor energy-efficient and reliable for various applications.

Terminal Form: BALL

Having a ball terminal form ensures reliable connections and easy mounting of the microprocessor, simplifying the assembly process and improving overall performance and durability.

Maximum Supply Current: 740 mA

Operating within a maximum supply current of 740 mA ensures efficient power usage and performance, making the microprocessor suitable for applications that require low power consumption.

Nominal Supply Voltage: 1.1 V

Maintaining a nominal supply voltage of 1.1 V ensures stable power delivery and optimal performance, making the microprocessor a reliable choice for a wide range of applications.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for compact and secure placement of the microprocessor on circuit boards, optimizing space usage and ensuring reliable connections for efficient operation.

Format: FLOATING POINT

Supporting floating-point operations improves the accuracy and precision of numerical calculations, making the microprocessor suitable for complex mathematical computations and scientific applications.

Moisture Sensitivity Level (MSL): 3

Having a moisture sensitivity level of 3 indicates that the microprocessor is resistant to moisture damage during storage and handling, ensuring long-term reliability and performance.

Speed: 800 rpm

Operating at a speed of 800 rpm enables fast data processing and response times, making the microprocessor suitable for applications that require high-speed computing and data handling.

Low Power Mode: YES

Featuring a low power mode enhances energy efficiency and prolongs battery life, making the microprocessor an ideal choice for portable devices and applications that require power optimization.

Technical Specifications

Microprocessors AM3715CUS attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

26

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

54 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B423

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

423

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA423,24X24,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.4 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

740 mA

Maximum Supply Voltage:

1.2 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16 mm

Peripheral IC Type:

Trade Compliance

AM3715CUS Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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