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AM3352ZCE27

Texas Instruments

AM3352ZCE27 by Texas Instruments

AM3352ZCE27 by Texas Instruments is a 32-bit microprocessor with integrated cache, 16-bit external data bus width, and max clock frequency of 26 MHz. It is used in applications requiring low power mode, such as embedded systems and IoT devices.

Median Price

$13.720

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 529 parts In-Stock

1+ parts

-

100+ parts

$11.870

1k+ parts

$10.620

10k+ parts

$9.990

529

-

$11.870

$10.620

$9.990

DigiKey

USA . 529 parts In-Stock

1+ parts

-

100+ parts

$13.720

1k+ parts

-

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529

-

$13.720

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Verical

USA . 369 parts In-Stock

1+ parts

-

100+ parts

$14.838

1k+ parts

$13.275

10k+ parts

$12.488

369

-

$14.838

$13.275

$12.488

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,101 parts In-Stock

1+ parts

$12.530

100+ parts

-

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-

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2,101

$12.530

-

-

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Vyrian

USA . 5,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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5,370

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-

-

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DigiKey Marketplace

USA . 529 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

529

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 826 parts In-Stock

1+ parts

$0.197

100+ parts

-

1k+ parts

-

10k+ parts

$0.189

826

$0.197

-

-

$0.189

Northwest PG Solutions

USA . 1,277 parts In-Stock

1+ parts

$0.216

100+ parts

-

1k+ parts

-

10k+ parts

$0.191

1,277

$0.216

-

-

$0.191

Corphita

USA . 2,687 parts In-Stock

1+ parts

$11.871

100+ parts

-

1k+ parts

-

10k+ parts

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2,687

$11.871

-

-

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Parana Technologies

USA . 1,223 parts In-Stock

1+ parts

$46.895

100+ parts

-

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1,223

$46.895

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DigiPath Technology Company

USA . 943 parts In-Stock

1+ parts

$51.637

100+ parts

$47.506

1k+ parts

-

10k+ parts

-

943

$51.637

$47.506

-

-

ChromeModa Solutions

Germany . 2,921 parts In-Stock

1+ parts

$52.691

100+ parts

$43.207

1k+ parts

-

10k+ parts

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2,921

$52.691

$43.207

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IDEA Electronic Components Group

UK . 310 parts In-Stock

1+ parts

$52.691

100+ parts

$50.056

1k+ parts

$47.422

10k+ parts

-

310

$52.691

$50.056

$47.422

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A-Z Elektronik GmbH

Germany . 5,879 parts In-Stock

1+ parts

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5,879

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Microchip USA

USA . 4,674 parts In-Stock

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4,674

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Alle Elektronik GmbH

Germany . 3,919 parts In-Stock

1+ parts

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3,919

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Perfect Parts

USA . 401 parts In-Stock

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401

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Overview

Experience unparalleled performance and reliability with the AM3352ZCE27 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge microprocessors that are perfect for a wide range of applications. Whether you're looking to enhance your IoT devices or upgrade your industrial equipment, this microprocessor offers superior quality and efficiency. With integrated cache and low power mode, the AM3352ZCE27 ensures optimal performance while minimizing energy consumption. Trust Texas Instruments to provide you with the best technology solutions for your business needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microprocessor easy to handle and resistant to damage during handling and installation.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing the time it takes to access frequently used data, resulting in faster processing speeds.

Maximum Supply Voltage: 1.144 V

Operating within a defined voltage range ensures the stability and reliability of the microprocessor, helping to prevent overheating and damage.

Address Bus Width: 28

A wider address bus allows the microprocessor to access larger amounts of memory, enabling it to handle more complex tasks and data processing efficiently.

Package Shape: SQUARE

The square package shape helps in efficient placement on circuit boards, optimizing space and promoting better airflow for cooling.

Bit Size: 32

Having a 32-bit architecture allows the microprocessor to handle larger chunks of data at once, improving overall performance and computational speed.

Power Supplies (V): 0.95/1.1

Supporting a range of power supplies ensures compatibility with various systems and environments, making the microprocessor versatile and adaptable.

No. of Terminals: 298

Having a high number of terminals enables the microprocessor to connect with multiple components and peripherals, expanding its functionality and potential applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The specific package style offers a compact design with efficient heat dissipation, allowing for better performance and reliability in tight spaces.

Minimum Supply Voltage: 1.056 V

Operating within a defined voltage range ensures the stability and reliability of the microprocessor, helping to prevent malfunctions and data corruption.

Terminal Finish: TIN SILVER COPPER

This finishing enhances conductivity and corrosion resistance, ensuring proper signal transmission and longevity of the microprocessor's terminals.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to the circuit board, simplifying the assembly process and ensuring secure mounting.

Maximum Seated Height: 1.3 mm

The low seated height allows for a slim profile and enables the microprocessor to fit in tight spaces, making it ideal for compact devices and systems.

Width: 13 mm

The compact width of the microprocessor makes it easy to integrate into different configurations and circuit layouts, optimizing space usage in various applications.

Boundary Scan: YES

Having boundary scan capability enables efficient testing and diagnostics of the microprocessor, simplifying maintenance and troubleshooting procedures.

External Data Bus Width: 16

The width of the external data bus determines the speed and efficiency of data transfers between the microprocessor and external components, enhancing overall performance.

Maximum Clock Frequency: 26 MHz

The high clock frequency allows the microprocessor to execute instructions quickly, resulting in fast processing speeds and improved overall performance.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time allowed at peak reflow temperature ensures proper soldering and connection of the microprocessor during manufacturing, preventing damage or defects.

Peak Reflow Temperature °C: 260

The peak reflow temperature is within a safe range for soldering operations, ensuring the integrity of the microprocessor and preventing heat-related issues.

Length: 13 mm

The compact length of the microprocessor allows for flexibility in design and integration, making it suitable for various form factors and space-constrained applications.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC (Reduced Instruction Set Computer) microprocessor offers simplified and efficient instruction processing, enabling faster performance and lower power consumption.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the microprocessor in various operating conditions.

Terminal Form: BALL

The ball terminal form facilitates reliable connections and efficient heat dissipation, ensuring stable operation and longevity of the microprocessor.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage determines the standard operating level for the microprocessor, ensuring compatibility and optimal performance in different systems and environments.

Terminal Pitch: 0.65 mm

The fine terminal pitch allows for compact and precise connections, optimizing space usage and signal integrity in high-density circuit designs.

Format: FIXED POINT

Having a fixed-point format simplifies math operations and enhances computational efficiency, making the microprocessor suitable for real-time processing and control applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture exposure, requiring standard handling procedures to prevent potential damage during storage, handling, and assembly.

Speed: 275 rpm

Having a high speed rating allows the microprocessor to process instructions quickly, enhancing overall system performance and responsiveness.

Low Power Mode: YES

Supporting a low power mode helps conserve energy and extend battery life in portable devices, making the microprocessor more energy-efficient and environmentally friendly.

Technical Specifications

Microprocessors AM3352ZCE27 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B298

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

298

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA298,19X19,25

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

Maximum Seated Height:

1.3 mm

Speed:

275 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

AM3352ZCE27 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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