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AM1707DZKB3

Texas Instruments

AM1707DZKB3 by Texas Instruments

The Texas Instruments AM1707DZKB3 microprocessor features 32-bit architecture, 8-word data RAM width, and 13-bit address bus. With a max clock frequency of 30 MHz, it is suitable for applications requiring low power consumption and high-speed processing in various industries. The device's integrated cache and boundary scan capability enhance performance and reliability in embedded systems.

Median Price

$11.238

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 210 parts In-Stock

1+ parts

$11.238

100+ parts

$9.817

1k+ parts

$6.770

10k+ parts

-

210

$11.238

$9.817

$6.770

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,072 parts In-Stock

1+ parts

$10.676

100+ parts

-

1k+ parts

-

10k+ parts

-

3,072

$10.676

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-

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Vyrian

USA . 3,048 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,048

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 210 parts In-Stock

1+ parts

$9.550

100+ parts

-

1k+ parts

-

10k+ parts

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210

$9.550

-

-

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Corphita

USA . 416 parts In-Stock

1+ parts

$10.114

100+ parts

-

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-

10k+ parts

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416

$10.114

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-

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AZTECH Wire

Italy . 631 parts In-Stock

1+ parts

$12.090

100+ parts

-

1k+ parts

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631

$12.090

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-

-

Parana Technologies

USA . 264 parts In-Stock

1+ parts

$36.923

100+ parts

-

1k+ parts

-

10k+ parts

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264

$36.923

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-

-

ChromeModa Solutions

Germany . 1,340 parts In-Stock

1+ parts

$41.487

100+ parts

$34.019

1k+ parts

-

10k+ parts

-

1,340

$41.487

$34.019

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-

IDEA Electronic Components Group

UK . 840 parts In-Stock

1+ parts

$41.487

100+ parts

$39.413

1k+ parts

$37.338

10k+ parts

-

840

$41.487

$39.413

$37.338

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Northwest PG Solutions

USA . 1,488 parts In-Stock

1+ parts

-

100+ parts

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1,488

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Native Components

USA . 910 parts In-Stock

1+ parts

-

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910

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DigiPath Technology Company

USA . 781 parts In-Stock

1+ parts

-

100+ parts

$37.405

1k+ parts

-

10k+ parts

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781

-

$37.405

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Perfect Parts

USA . 101 parts In-Stock

1+ parts

-

100+ parts

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101

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Overview

Experience unparalleled performance and reliability with the AM1707DZKB3 microprocessor from Texas Instruments. Built with cutting-edge technology and a commitment to quality, this powerful chip is perfect for a wide range of applications. Whether you're looking to enhance your industrial automation systems or boost the efficiency of your automotive electronics, this microprocessor offers exceptional value and benefits. Trust in Texas Instruments to deliver top-of-the-line products that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for portable electronic devices

Integrated Cache: YES

Improves processing speed by storing frequently accessed data for quick retrieval

Maximum Supply Voltage: 1.32 V

Allows for efficient power consumption and compatibility with various power sources

On Chip Data RAM Width: 8

Enhances data processing capabilities for multitasking and complex computations

Address Bus Width: 13

Supports a wide range of memory addressing for large data storage and access

Package Shape: SQUARE

Provides a compact and space-efficient design for integrated circuit placement

Bit Size: 32

Offers high computational power and accuracy for demanding applications

Power Supplies (V): 1.2,1.8/3.3

Versatile voltage options for flexibility in power management and performance optimization

No. of Terminals: 256

Allows for multiple connections and input/output interfaces for external devices

Package Style (Meter): GRID ARRAY, FINE PITCH

Enables high density packaging and efficient thermal management for improved performance

Minimum Supply Voltage: 1.14 V

Ensures stable operation at low power input levels for energy efficiency

Maximum Operating Temperature: 90 °C

Suitable for operation in a wide range of environmental conditions without performance degradation

Minimum Operating Temperature: 0 °C

Maintains functionality even in low temperature environments for reliable performance

Terminal Finish: TIN SILVER COPPER

Provides excellent conductivity and corrosion resistance for long-term reliability

Terminal Position: BOTTOM

Facilitates easy and secure mounting on circuit boards for stable connections

Maximum Seated Height: 2.05 mm

Low profile design for compact electronic devices with limited internal space

RAM Words: 172032

Large memory capacity for storing and processing vast amounts of data efficiently

Width: 17 mm

Compact form factor for integration into small electronic devices

Boundary Scan: YES

Allows for testing and debugging of components and connections for improved reliability

External Data Bus Width: 16

Efficient data transfer capabilities for high-speed communication with external devices

Maximum Clock Frequency: 30 MHz

High operating frequency for fast data processing and performance

Peak Reflow Temperature °C: 260

Sufficient heat tolerance for soldering and reflow processes during manufacturing

Peripheral IC Type: MICROPROCESSOR, RISC

Designed for efficient instruction execution and reduced power consumption

Technology: CMOS

Low power consumption and high noise immunity for reliable operation

Terminal Form: BALL

Secure and reliable electrical connections for stable performance

Nominal Supply Voltage: 1.2 V

Optimal operating voltage for efficient power consumption and performance

No. of DMA Channels: 40

Multiple channels for direct memory access for fast data transfer and processing

Terminal Pitch: 0.5 mm

Fine pitch spacing for compact design and efficient PCB layout

Format: FIXED POINT

Precision in numerical calculations and data processing for accurate results

Moisture Sensitivity Level (MSL): 3

Resistant to moisture exposure for reliable operation in various environments

Speed: 375 rpm

Efficient processing speed for quick data retrieval and execution

Low Power Mode: YES

Enables energy-saving mode for extended battery life and reduced power consumption

Technical Specifications

Microprocessors AM1707DZKB3 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

40

No. of Terminals:

256

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

RAM Words:

172032

Maximum Seated Height:

2.05 mm

Speed:

375 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

AM1707DZKB3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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