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74ABTH16823DGGRG4

Texas Instruments

74ABTH16823DGGRG4 by Texas Instruments

74ABTH16823DGGRG4 by Texas Instruments is a Bus Driver & Transceiver with 9 bits, 6.8 ns propagation delay, and 64 Amp max I (ol). It operates at a supply voltage of 5V and has a max frequency of 150MHz. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,618 parts In-Stock

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Digiode

USA . 2,933 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 604 parts In-Stock

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$5.818

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One Stop Electronics

USA . 1,087 parts In-Stock

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$13.000

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Parana Technologies

USA . 341 parts In-Stock

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$13.595

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$14.095

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341

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DigiPath Technology Company

USA . 1,486 parts In-Stock

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$14.970

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$13.772

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ChromeModa Solutions

Germany . 3,466 parts In-Stock

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$15.275

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$12.526

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IDEA Electronic Components Group

UK . 1,420 parts In-Stock

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$15.275

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$14.511

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$13.748

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$13.748

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Andel Nordic

Denmark . 194 parts In-Stock

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$60.432

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$58.014

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$58.014

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Corphita

USA . 3,795 parts In-Stock

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Northwest PG Solutions

USA . 1,863 parts In-Stock

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Microchip USA

USA . 470 parts In-Stock

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Native Components

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Overview

Enhance the efficiency and reliability of your electronic systems with the 74ABTH16823DGGRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Bus Driver & Transceivers that excel in performance and durability. This versatile product offers 9 bits of functionality in a compact package, making it ideal for a wide range of applications. With a low propagation delay and high maximum frequency, this device ensures swift data transmission and seamless operation. Trust Texas Instruments to provide you with the cutting-edge technology you need for your projects. Elevate your designs with the 74ABTH16823DGGRG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the bus driver & transceiver.

Propagation Delay At Nominal Supply: 6.8 ns

Fast propagation delay ensures efficient and timely transmission of data signals.

Surface Mount: YES

Enables easy integration onto circuit boards for streamlined assembly processes.

No. of Functions: 2

Offers multiple functions in a single component, saving space and cost in the design.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supplies for convenient power requirements.

Power Supplies (V): 5

Consistent power supply ensures stable operation of the bus driver & transceiver.

No. of Terminals: 56

Sufficient terminals for connections and interface with other components in the system.

Maximum I (ol): 64 Amp

High output current capability for driving various loads in the circuit.

Output Characteristics: 3-STATE

Provides flexibility in controlling the output state for different operational modes.

Minimum Operating Temperature: -40 °C

Wide temperature range allows reliable operation in various environmental conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications with elevated temperature requirements.

Maximum Frequency At Nominal Supply: 150000000 Hz

High-frequency capability for fast data transmission and communication.

Technical Specifications

Bus Driver & Transceivers 74ABTH16823DGGRG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

ABT

JESD-30 Code:

R-PDSO-G56

Length:

14 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

64 Amp

No. of Bits:

9

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

80 mA

Propagation Delay At Nominal Supply:

6.8 ns

Propagation Delay (tpd):

6.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74ABTH16823DGGRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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