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74ABT16245BDGG

NXP Semiconductors

74ABT16245BDGG by NXP Semiconductors

NXP Semiconductors' 74ABT16245BDGG is a Bus Driver & Transceiver with 8-bit capacity, 4ns propagation delay, and 64A max I (ol). It operates at a nominal voltage of 5V and has a load capacitance of 50pF. Ideal for industrial applications requiring bidirectional control in compact spaces.

Median Price

$0.700

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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DF Sales Co.

USA . 1,950 parts In-Stock

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$0.700

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DF Sales Co.

USA . 1,950 parts In-Stock

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North Shore Components

USA . 5,058 parts In-Stock

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Vyrian

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Digiode

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ComSIT Distribution GmbH

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Anansix

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LIBRA Elektronik GmbH

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Lighthouse Electronics, Inc.

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Nova Conductors

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ACDS - Activité Composants Distribution Service

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Andel Nordic

Denmark . 929 parts In-Stock

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$2.567

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$2.465

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AZTECH Wire

Italy . 8,051 parts In-Stock

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$12.573

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Ampacity Inc.

Singapore . 626 parts In-Stock

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Semicontronic

India . 1,030 parts In-Stock

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One Stop Electronics

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Component Stockers USA

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Lixinc

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Argo Parts USA

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Overview

Experience seamless data transmission and reliable performance with the 74ABT16245BDGG by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-notch quality and innovation in bus drivers and transceivers. This versatile product offers fast propagation delay, low power consumption, and a wide operating temperature range, making it ideal for various industrial applications. Trust NXP to provide cutting-edge technology that enhances efficiency and productivity in your projects. Elevate your designs with the 74ABT16245BDGG and experience superior connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package lightweight and durable, ideal for use in various applications without adding unnecessary weight.

Propagation Delay At Nominal Supply: 4 ns

The low propagation delay ensures fast and efficient signal transmission, making this product suitable for high-speed data communication in bus driver and transceiver applications.

No. of Functions: 2

Having multiple functions in a single package reduces component count, saves board space, and simplifies circuit design, making this product a cost-effective solution.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V is a common standard in many electronic systems, ensuring compatibility with a wide range of applications.

No. of Bits: 8

With 8 bits, this product can handle a wider range of data inputs and outputs, making it versatile and suitable for various data processing tasks.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows this product to operate in challenging environments without the risk of overheating, ensuring reliable performance.

Output Characteristics: 3-STATE

The 3-STATE output allows the device to drive the bus line to a high impedance state when not actively transmitting data, reducing power consumption and minimizing interference with other devices on the bus.

Technology: BICMOS

The BICMOS technology combines the advantages of bipolar and CMOS technologies, offering high-speed operation, low power consumption, and high noise immunity, making this product an efficient and reliable choice.

Technical Specifications

Bus Driver & Transceivers 74ABT16245BDGG attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

19 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

6.1 mm

Trade Compliance

74ABT16245BDGG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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