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74ABT16245BDGG,518

NXP Semiconductors

74ABT16245BDGG,518 by NXP Semiconductors

NXP Semiconductors' 74ABT16245BDGG,518 is an 8-bit bus driver with 3-STATE output. It operates at a supply voltage range of 4.5V to 5.5V and has a propagation delay of 4ns. This BICMOS technology chip is ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

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Lifecycle Status

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6

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1k+

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Chip Stock

USA . 167,000 parts In-Stock

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Vyrian

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Digiode

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Anansix

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Nova Conductors

Japan . 88 parts In-Stock

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Andel Nordic

Denmark . 346 parts In-Stock

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$3.274

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AZTECH Wire

Italy . 10,206 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 1,489 parts In-Stock

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Semicontronic

India . 473 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 3,716 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Microchip USA

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Overview

Unleash the power of seamless data transmission with the 74ABT16245BDGG,518 by NXP Semiconductors. Known for its high-quality manufacturing and cutting-edge technology, this bus driver & transceiver offers unmatched reliability and performance in a compact package. Ideal for a wide range of applications, this product ensures fast propagation delay, true output polarity, and 3-state output characteristics. Experience the convenience and efficiency of this industrial-grade solution, designed to elevate your projects to new heights. Elevate your circuits with NXP Semiconductors today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable construction, ideal for applications that require portability and ruggedness.

Surface Mount: YES

Enables easy and convenient installation on PCBs, saving time and effort during assembly.

No. of Functions: 2

Offers multiple functions in a single component, reducing the need for additional components and saving board space.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage, ensuring compatibility with most systems and power sources.

Propagation Delay (tpd): 4 ns

Provides fast signal processing speed, making this product suitable for high-speed communication applications.

Temperature Grade: INDUSTRIAL

Designed to withstand a wide range of temperatures, making it suitable for industrial environments with varying temperature conditions.

Technology: BICMOS

Utilizes BiCMOS technology for efficient power consumption and high-speed performance, making it an energy-efficient choice for bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers 74ABT16245BDGG,518 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

ABT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74ABT16245BDGG,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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