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74ABT125D,602

NXP Semiconductors

74ABT125D,602 by NXP Semiconductors

NXP Semiconductors' 74ABT125D,602 is a Bus Driver & Transceiver with 4 functions and 3-STATE output. It operates at a nominal voltage of 5V, has a propagation delay of 4.9ns, and can handle load capacitance of 50pF. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

$0.547

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Rochester

USA . 78,691 parts In-Stock

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$0.527

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$0.437

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$0.390

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Verical

USA . 53,030 parts In-Stock

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$0.547

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$0.487

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DigiKey

USA . 4,248 parts In-Stock

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$0.660

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Avnet

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Digiode

USA . 2,950 parts In-Stock

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Chip Stock

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Vyrian

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Anansix

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VNN

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Sea View Technologies

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Bristol Electronics

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Atlantic Semiconductor

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Nova Conductors

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Ampacity Inc.

Singapore . 13,517 parts In-Stock

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$0.189

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Semicontronic

India . 13,352 parts In-Stock

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$0.184

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$0.183

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Corphita

USA . 4,180 parts In-Stock

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AZTECH Wire

Italy . 13,660 parts In-Stock

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Corohmni

South Africa . 293 parts In-Stock

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Andel Nordic

Denmark . 4,424 parts In-Stock

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$7.411

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$7.114

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$7.114

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$7.114

Aztec Data Supply Inc.

USA . 1,589 parts In-Stock

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$12.010

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Authorized Procurement Solutions

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UNI Independent Distributors

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Perfect Parts

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Argo Parts USA

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Continental Prestige Electronics

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GreenTree Electronics

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Aranea Global

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Supply Digital

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Microchip USA

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Overview

Elevate your electronic designs with the 74ABT125D,602 by NXP Semiconductors! Crafted with precision and expertise, this bus driver & transceiver offers unparalleled quality and reliability. With a nominal supply voltage of 5V and a propagation delay of just 4.9ns, this versatile component is ideal for a wide range of applications. From industrial automation to consumer electronics, this product delivers exceptional performance, efficiency, and value. Upgrade your projects today with NXP Semiconductors' cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the bus driver & transceivers, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 4.9 ns

The low propagation delay ensures fast signal transmission, making this product suitable for high-speed data communication applications.

Surface Mount: YES

The surface mount feature allows for easy integration onto circuit boards, saving space and simplifying the assembly process.

No. of Functions: 4

Having multiple functions in a single component reduces the need for additional components, resulting in a more compact and cost-effective solution.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement on the circuit board, optimizing space utilization.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes this product compatible with a wide range of systems and power sources.

Load Capacitance (CL): 50 pF

The specified load capacitance helps in determining the power consumption and signal integrity of the bus driver & transceivers.

Power Supplies (V): 5

With power supplies rated at 5V, this product can be easily integrated into existing systems without the need for additional voltage converters.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The terminal finish provides good conductivity and corrosion resistance, ensuring reliable electrical connections.

Temperature Grade: INDUSTRIAL

Suitable for industrial temperature environments, this product can withstand harsh operating conditions, making it a robust choice for industrial applications.

Technical Specifications

Bus Driver & Transceivers 74ABT125D,602 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION

Control Type:

ENABLE LOW

Family:

ABT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

4.9 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74ABT125D,602 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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