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74ABT16245BDGG-T

NXP Semiconductors

74ABT16245BDGG-T by NXP Semiconductors

NXP Semiconductors' 74ABT16245BDGG-T is an 8-bit bus driver with 3-STATE output, BICMOS technology, and dual ports. It operates at a supply voltage range of 4.5V to 5.5V, with a propagation delay of 4ns. Ideal for industrial applications requiring fast signal transmission in compact spaces due to its small outline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,740 parts In-Stock

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Digiode

USA . 2,090 parts In-Stock

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Vyrian

USA . 1,229 parts In-Stock

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VNN

France . 686 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 795 parts In-Stock

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$5.547

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Andel Nordic

Denmark . 4,744 parts In-Stock

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$8.276

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$7.945

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$7.945

Semicontronic

India . 1,459 parts In-Stock

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$32.000

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$31.200

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$31.040

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One Stop Electronics

USA . 318 parts In-Stock

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$35.000

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Ampacity Inc.

Singapore . 1,363 parts In-Stock

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$40.000

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UNI Independent Distributors

Spain . 6,021 parts In-Stock

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Corphita

USA . 4,028 parts In-Stock

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Argo Parts USA

USA . 2,967 parts In-Stock

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Continental Prestige Electronics

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Aranea Global

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Overview

Unlock seamless communication and data transfer with the 74ABT16245BDGG-T by NXP Semiconductors. Crafted with precision and expertise, this bus driver & transceiver embodies reliability and efficiency. Whether in industrial automation, telecommunications, or automotive applications, this product delivers unparalleled performance, enhancing connectivity and streamlining operations. Experience the value of quality engineering and innovation with NXP Semiconductors' cutting-edge technology, setting new standards for speed, precision, and versatility in the semiconductor industry. Elevate your projects with the 74ABT16245BDGG-T and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

This feature allows for easy integration onto circuit boards, saving space and streamlining the assembly process.

No. of Functions: 2

With multiple functions in a single package, this product offers efficiency and versatility in circuit design.

Package Shape: RECTANGULAR

The rectangular shape of the package provides a compact and organized layout, optimizing space on the circuit board.

No. of Bits: 8

The 8-bit design offers a wide range of data processing capabilities, making it suitable for complex tasks.

Nominal Supply Voltage (Vsup): 5V

Operating at a standard voltage of 5V, this product is compatible with many power sources, ensuring universal usability.

Load Capacitance (CL): 50 pF

The low load capacitance allows for fast signal transmission, enhancing the efficiency of the product.

No. of Terminals: 48

With 48 terminals available, this product offers ample connectivity options for various system configurations.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and sleek package style makes this product suitable for applications with space constraints.

Propagation Delay (tpd): 4 ns

The short propagation delay ensures quick data transfer, facilitating real-time communication within the circuit.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this product can withstand harsh environmental conditions, making it reliable for industrial use.

Output Characteristics: 3-STATE

The 3-state output allows for tri-state logic, enabling flexibility in controlling signal flow within the circuit.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable performance even in extreme cold conditions, making this product versatile for various environments.

Technical Specifications

Bus Driver & Transceivers 74ABT16245BDGG-T attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH DIRECTION CONTROL

Family:

ABT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Power Supply Current (ICC):

19 mA

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74ABT16245BDGG-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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