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74ABT16245BDGG,512

NXP Semiconductors

74ABT16245BDGG,512 by NXP Semiconductors

NXP Semiconductors' 74ABT16245BDGG,512 is an 8-bit bus driver with 2 functions. It operates at a supply voltage range of 4.5V to 5.5V and has a propagation delay of 4ns. Ideal for industrial applications requiring true output polarity and dual terminal position in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 112,000 parts In-Stock

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VNN

France . 4,101 parts In-Stock

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Digiode

USA . 3,506 parts In-Stock

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Vyrian

USA . 2,402 parts In-Stock

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Anansix

USA . 876 parts In-Stock

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Nova Conductors

Japan . 92 parts In-Stock

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Andel Nordic

Denmark . 2,654 parts In-Stock

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$7.451

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$7.153

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AZTECH Wire

Italy . 191 parts In-Stock

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$16.946

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$18.768

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$17.079

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$15.390

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Corohmni

South Africa . 638 parts In-Stock

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$21.729

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Semicontronic

India . 373 parts In-Stock

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$26.000

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$25.350

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Ampacity Inc.

Singapore . 822 parts In-Stock

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One Stop Electronics

USA . 1,571 parts In-Stock

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Corphita

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UNI Independent Distributors

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Argo Parts USA

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Continental Prestige Electronics

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Microchip USA

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Bastille Electronics

Australia . 85 parts In-Stock

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Overview

Enhance your electronic designs with the 74ABT16245BDGG,512 by NXP Semiconductors! This high-quality bus driver & transceiver offers reliable performance and versatility for a wide range of applications. With its advanced technology and industrial-grade temperature tolerance, this component ensures optimal functionality in any environment. Trust NXP Semiconductors to deliver top-notch products that provide value, efficiency, and seamless integration into your projects. Upgrade your systems today with the 74ABT16245BDGG,512 and experience superior quality like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight, durable, and cost-effective.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort.

No. of Functions: 2

With multiple functions, this product offers versatility and flexibility in bus driver applications.

Package Shape: RECTANGULAR

The rectangular shape ensures efficient use of space on the circuit board.

No. of Bits: 8

With 8 bits, this product can handle a wide range of data transmission tasks efficiently.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures reliable and stable performance in various operating conditions.

No. of Terminals: 48

The large number of terminals allows for multiple connections and integration with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style makes the product compact and suitable for space-constrained applications.

Propagation Delay (tpd): 4 ns

The low propagation delay ensures fast and efficient data transmission.

Maximum Operating Temperature: 85 °C

The high operating temperature range makes the product suitable for industrial environments.

Output Characteristics: 3-STATE

The 3-state output allows for flexible control of the output signal.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable performance in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

The dual terminal position allows for easy connection to the circuit board.

No. of Ports: 2

With 2 ports, this product can handle multiple input/output connections simultaneously.

Maximum Seated Height: 1.2 mm

The low seated height saves space on the circuit board and allows for compact designs.

Width: 6.1 mm

The narrow width makes the product suitable for applications with limited space.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage allows for operation in low-power environments.

Length: 12.5 mm

The compact length makes the product suitable for space-limited applications.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance ensures reliable performance in harsh environments.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS technologies for enhanced performance.

Terminal Form: GULL WING

The gull wing terminal form allows for secure and reliable connections to the circuit board.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting on the circuit board.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources.

Technical Specifications

Bus Driver & Transceivers 74ABT16245BDGG,512 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

ABT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Propagation Delay (tpd):

4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74ABT16245BDGG,512 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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