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74ABT652N

NXP Semiconductors

74ABT652N by NXP Semiconductors

NXP Semiconductors' 74ABT652N is an 8-bit bus driver with a propagation delay of 8.4 ns, operating at a voltage range of 4.5V to 5.5V. Ideal for industrial applications requiring true output polarity and a load capacitance of 50 pF, this BICMOS technology-based transceiver has dual terminals in an inline package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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VNN

France . 9,522 parts In-Stock

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Digiode

USA . 2,610 parts In-Stock

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Anansix

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Vyrian

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Nova Conductors

Japan . 870 parts In-Stock

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PC Components Company LLC

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Bristol Electronics

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Andel Nordic

Denmark . 530 parts In-Stock

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AZTECH Wire

Italy . 277 parts In-Stock

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Semicontronic

India . 1,393 parts In-Stock

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One Stop Electronics

USA . 1,314 parts In-Stock

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Ampacity Inc.

Singapore . 447 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

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Bastille Electronics

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Overview

Enhance your electronic projects with the NXP Semiconductors 74ABT652N Bus Driver & Transceivers. Crafted with precision and quality, this innovative component offers seamless integration and reliable performance. With a wide range of applications in various industries, this product provides exceptional value and benefits to customers looking for efficient data transmission solutions. Trust NXP Semiconductors for superior technology and elevate your projects to new heights with the 74ABT652N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability in various environmental conditions.

No. of Bits: 8

Provides sufficient data transmission capacity for bus driver applications.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard 5V power supply systems.

Propagation Delay (tpd): 8.4 ns

Fast propagation delay ensures efficient data transmission.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme low-temperature conditions.

Maximum Operating Temperature: 85 °C

Operates reliably in high-temperature industrial environments.

Technology: BICMOS

Utilizes Bipolar-CMOS technology for improved performance and efficiency.

Technical Specifications

Bus Driver & Transceivers 74ABT652N attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

SELECT INPUT FOR MULTIPLEXED TRANSMISSION OF REGISTERED/REAL TIME DATA

Family:

ABT

JESD-30 Code:

R-PDIP-T24

Length:

31.7 mm

Load Capacitance (CL):

50 pF

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Maximum Power Supply Current (ICC):

30 mA

Propagation Delay (tpd):

8.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74ABT652N Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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