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SN74LVC244ADBR

Texas Instruments

SN74LVC244ADBR by Texas Instruments

SN74LVC244ADBR by Texas Instruments is a 20-terminal bus driver with 7.2 ns propagation delay, ideal for automotive applications. It operates at a nominal voltage of 1.8V and has a max operating temperature of 125°C. With surface mount capability and true output polarity, it offers efficient signal transmission in compact designs.

Median Price

$0.142

Lifecycle Status

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38

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Rochester

USA . 2,629 parts In-Stock

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Adafruit Industries

USA . 350 parts In-Stock

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Texas Instruments

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DigiKey

USA . 2,515 parts In-Stock

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Element14

Singapore . 3,650 parts In-Stock

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Chip1Stop

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Verical

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Freelance Electronics

USA . 443 parts In-Stock

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Digiode

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Nova Conductors

Japan . 600 parts In-Stock

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Maritex

Poland . 1,519 parts In-Stock

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Component Electronics Inc.

Canada . 945 parts In-Stock

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Microfarads

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Ampacity Inc.

Singapore . 10,792 parts In-Stock

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Semicontronic

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Corphita

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Argo Parts USA

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Corohmni

South Africa . 247 parts In-Stock

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Advanced Electronics

New Zealand . 350 parts In-Stock

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Netroflash

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Component Stockers USA

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Continental Prestige Electronics

USA . 70 parts In-Stock

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Microchip USA

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Andel Nordic

Denmark . 2,359 parts In-Stock

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Parana Technologies

USA . 1,224 parts In-Stock

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DigiPath Technology Company

USA . 2,094 parts In-Stock

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ChromeModa Solutions

Germany . 2,528 parts In-Stock

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IDEA Electronic Components Group

UK . 2,143 parts In-Stock

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$24.801

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Perfect Parts

USA . 258,506 parts In-Stock

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GreenTree Electronics

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Robosynatics

Brazil . 500 parts In-Stock

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$0.330

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$0.330

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$0.330

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Lucentia Tech

USA . 500 parts In-Stock

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$0.330

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$0.330

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$0.330

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ChipTracer

USA . 466 parts In-Stock

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Speed Components Ltd (Excess)

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Overview

Unlock exceptional performance and reliability with the Texas Instruments SN74LVC244ADBR, a top-of-the-line Bus Driver & Transceiver. Crafted from high-quality materials, this product boasts a fast propagation delay of 7.2ns and a wide range of applications in diverse industries. With a compact design and advanced features like 3-STATE output characteristics, customers can expect seamless operation at a nominal supply voltage of 1.8V. Elevate your projects with the unmatched value and benefits that this innovative solution offers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for automotive applications.

Propagation Delay At Nominal Supply: 7.2 ns

With a low propagation delay, this product ensures quick and efficient signal transmission, making it suitable for high-speed communication systems.

Surface Mount: YES

The surface mount capability of this product simplifies the installation process and conserves space on PCBs, making it a convenient choice for compact designs.

No. of Functions: 2

This product offers multiple functions in one unit, saving on component costs and board space, making it a cost-effective solution for integrated systems.

Package Shape: RECTANGULAR

The rectangular package shape of this product allows for efficient placement on PCBs and easy integration into existing designs.

No. of Bits: 4

With 4 bits, this product offers a wide range of signal possibilities, making it versatile and adaptable to various communication protocols.

Nominal Supply Voltage / Vsup (V): 1.8

The low supply voltage requirement of 1.8V makes this product energy-efficient and compatible with a range of power sources.

Power Supplies (V): 3.3

With support for 3.3V power supplies, this product is widely compatible with standard voltage levels in electronic systems.

No. of Terminals: 20

The ample number of terminals on this product allows for versatile connections and configurations, enhancing its functionality and usability.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch of the package style make this product space-saving and suitable for compact designs.

Maximum I (ol): 24 Amp

The high maximum output current of 24A ensures robust signal transmission and compatibility with various loads, making it suitable for demanding applications.

Propagation Delay (tpd): 16.4 ns

The low propagation delay of 16.4ns ensures fast signal propagation, reducing latency and improving system performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions, making it suitable for automotive use.

Output Characteristics: 3-STATE

The 3-state output characteristics of this product allow for flexible signal control and modulation, enhancing its versatility in communication systems.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product can function reliably in cold climates or extreme temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides corrosion resistance and ensures long-term reliability, making this product ideal for rugged environments.

Terminal Position: DUAL

The dual terminal position provides flexibility in PCB layout and component placement, allowing for efficient and optimized circuit designs.

No. of Ports: 2

With 2 ports, this product offers dual connectivity options, enabling simultaneous data transmission and reception, enhancing system functionality.

Maximum Seated Height: 2 mm

The low maximum seated height of 2mm allows for compact and low-profile PCB designs, making this product suitable for space-constrained applications.

Width: 5.3 mm

The narrow width of 5.3mm allows for efficient use of PCB space and component placement, making this product ideal for densely packed electronic systems.

Output Polarity: TRUE

The true output polarity ensures accurate signal representation and compatibility with standard logic levels, making this product easy to integrate into existing circuits.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement of 1.65V ensures energy efficiency and compatibility with a wide range of power sources.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and reflow processes, ensuring reliable connections and performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring robust and durable solder joints.

Length: 7.2 mm

The compact length of 7.2mm allows for space-efficient PCB layout and integration, making this product suitable for miniaturized electronic devices.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable performance in automotive applications, making this product suitable for use in vehicles.

Technology: CMOS

The CMOS technology employed in this product offers low power consumption and high noise immunity, making it energy-efficient and reliable in various operating conditions.

Terminal Form: GULL WING

The gull wing terminal form provides easy soldering and strong mechanical connections, ensuring reliable performance in challenging environments.

Packing Method: TR

The TR packing method offers convenient handling and storage, ensuring product protection during transportation and assembly processes.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density PCB layouts and compact designs, making this product suitable for miniaturized applications.

Count Direction: UNIDIRECTIONAL

The unidirectional count direction simplifies signal processing and control, enhancing system efficiency and performance.

Control Type: ENABLE LOW

The enable low control type offers easy signal modulation and manipulation, enhancing system flexibility and adaptability.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this product can safely operate within standard voltage ranges, ensuring compatibility with common power sources.

Maximum Power Supply Current (ICC): 0.04 mA

The low maximum power supply current of 0.04mA ensures energy efficiency and minimal power consumption, making this product ideal for battery-powered devices.

Technical Specifications

Bus Driver & Transceivers SN74LVC244ADBR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

7.2 ns

Propagation Delay (tpd):

16.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

SN74LVC244ADBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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