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VND830LSPTR-E

STMicroelectronics

VND830LSPTR-E by STMicroelectronics

VND830LSPTR-E by STMicroelectronics is a dual-channel peripheral driver with a max supply voltage of 36V and an output current capacity of 18A. It features built-in protections against overcurrent, overvoltage, and thermal issues. Ideal for automotive applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ComSIT Distribution GmbH

Germany . 10,200 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10,200

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Vyrian

USA . 8,149 parts In-Stock

1+ parts

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8,149

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Digiode

USA . 3,063 parts In-Stock

1+ parts

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3,063

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Anansix

USA . 1,601 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,601

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Chip Stock

USA . 668 parts In-Stock

1+ parts

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100+ parts

-

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668

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Sensible Micro Corp

USA . 325 parts In-Stock

1+ parts

-

100+ parts

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325

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,674 parts In-Stock

1+ parts

$4.458

100+ parts

-

1k+ parts

$4.012

10k+ parts

-

1,674

$4.458

-

$4.012

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MKK Technologies

India . 2,023 parts In-Stock

1+ parts

$8.384

100+ parts

-

1k+ parts

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10k+ parts

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2,023

$8.384

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DigiPath Technology Company

USA . 2,023 parts In-Stock

1+ parts

$8.384

100+ parts

-

1k+ parts

-

10k+ parts

-

2,023

$8.384

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-

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AZTECH Wire

Italy . 1,018 parts In-Stock

1+ parts

$9.250

100+ parts

-

1k+ parts

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10k+ parts

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1,018

$9.250

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Microchip USA

USA . 326 parts In-Stock

1+ parts

$59.912

100+ parts

-

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10k+ parts

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326

$59.912

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Component Stockers USA

USA . 448 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

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448

$99.990

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Authorized Procurement Solutions

USA . 8,500 parts In-Stock

1+ parts

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8,500

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Corphita

USA . 3,859 parts In-Stock

1+ parts

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3,859

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iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

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900

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Parana Technologies

USA . 463 parts In-Stock

1+ parts

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100+ parts

$5.331

1k+ parts

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463

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$5.331

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XScomponents

USA . 325 parts In-Stock

1+ parts

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100+ parts

$1.720

1k+ parts

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10k+ parts

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325

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$1.720

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Overview

Unlock unparalleled performance with the VND830LSPTR-E from STMicroelectronics—a leader in innovative semiconductor solutions. This versatile peripheral driver enhances your designs, offering robust built-in protections against transient, overcurrent, and thermal issues. Ideal for various applications, it ensures seamless operation and reliability. Elevate your projects with superior quality, efficiency, and peace of mind—all backed by STMicroelectronics' commitment to excellence. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, enhancing product longevity.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient space usage on printed circuit boards.

Maximum Supply Voltage: 36 V

With a maximum supply voltage of 36 V, this driver can handle a wide range of applications, making it versatile.

No. of Functions: 2

The dual-functionality provides flexibility in design, allowing for more complex implementations without needing additional components.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into various layouts, optimizing space and performance.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections enhance reliability and safety, preventing damage under abnormal operating conditions.

Power Supplies (V): 8/36

Supporting a supply voltage range from 8 to 36 V allows this driver to work in diverse power environments.

No. of Terminals: 10

Ten terminals provide ample connectivity options, enabling easy integration with other circuit elements.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline with a heat sink ensures efficient thermal management, suitable for high-power applications.

Minimum Supply Voltage: 5.5 V

A minimum supply voltage of 5.5 V ensures compatibility with low-voltage systems, expanding its usability.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and helps prevent corrosion, ensuring durable connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible routing in a PCB, aiding in design and layout optimization.

Maximum Seated Height: 3.75 mm

A low seated height of 3.75 mm contributes to compact designs, suitable for space-constrained applications.

Width: 7.5 mm

With a width of 7.5 mm, this component fits well within regulated dimensions for efficient design.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds supports efficient manufacturing processes without compromising quality.

Peak Reflow Temperature °C: 250

The peak reflow temperature of 250 °C is compatible with modern soldering techniques, facilitating easy assembly.

Length: 9.4 mm

The 9.4 mm length allows for precise placement in designs, ensuring efficient use of PCB real estate.

Maximum Output Current: 18 A

A maximum output current of 18 A supports high-power applications, making this product suitable for demanding tasks.

Terminal Form: GULL WING

Gull wing terminals provide easy accessibility for soldering and improve the mechanical strength of connections.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V optimally caters to most operational conditions, ensuring efficient performance.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for closer component placement, making it beneficial for dense PCB layouts.

Driver No. of Bits: 2

Utilizing a 2-bit driver architecture offers straightforward control, simplifying system design and integration.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product has moderate sensitivity to moisture, making it suitable for a range of applications.

Nominal Output Peak Current Limit: 23 A

The nominal output peak current limit of 23 A ensures high performance under load, making this driver reliable for intense applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter interface enables compatibility with a variety of systems, enhancing its application scope.

Output Current Flow Direction: SOURCE

The source output current flow direction allows for efficient interfacing with downstream components or circuits.

Technical Specifications

Peripheral Drivers VND830LSPTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Maximum Output Current:

18 A

Nominal Output Peak Current Limit:

23 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND830LSPTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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