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VND810MSPTR-E

STMicroelectronics

VND810MSPTR-E by STMicroelectronics

VND810MSPTR-E by STMicroelectronics is a dual-channel peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent and thermal issues. It features a compact SO package, ideal for space-constrained applications. This driver supports output currents up to 0.9A, making it suitable for automotive and industrial uses.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,810

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-

-

-

Digiode

USA . 1,961 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,961

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-

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Anansix

USA . 677 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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677

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,647 parts In-Stock

1+ parts

$8.822

100+ parts

-

1k+ parts

$7.940

10k+ parts

-

1,647

$8.822

-

$7.940

-

MKK Technologies

India . 1,402 parts In-Stock

1+ parts

$16.589

100+ parts

-

1k+ parts

-

10k+ parts

-

1,402

$16.589

-

-

-

DigiPath Technology Company

USA . 1,402 parts In-Stock

1+ parts

$16.589

100+ parts

-

1k+ parts

-

10k+ parts

-

1,402

$16.589

-

-

-

AZTECH Wire

Italy . 585 parts In-Stock

1+ parts

$21.230

100+ parts

-

1k+ parts

-

10k+ parts

-

585

$21.230

-

-

-

Ampacity Inc.

Singapore . 373 parts In-Stock

1+ parts

$44.500

100+ parts

-

1k+ parts

-

10k+ parts

-

373

$44.500

-

-

-

Microchip USA

USA . 281 parts In-Stock

1+ parts

$54.841

100+ parts

-

1k+ parts

-

10k+ parts

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281

$54.841

-

-

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Component Stockers USA

USA . 455 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

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10k+ parts

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455

$99.990

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-

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Corphita

USA . 3,592 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,592

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-

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Parana Technologies

USA . 1,611 parts In-Stock

1+ parts

-

100+ parts

$10.548

1k+ parts

-

10k+ parts

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1,611

-

$10.548

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iodParts Technologies Inc.

India . 900 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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900

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Overview

Elevate your projects with the VND810MSPTR-E from STMicroelectronics, where cutting-edge technology meets unmatched reliability. Designed for diverse applications, this robust peripheral driver offers exceptional built-in protections against overcurrent, voltage spikes, and thermal issues, ensuring peace of mind in every implementation. Trust in STMicroelectronics' legacy of quality to deliver performance that enhances efficiency and durability—empowering you to innovate without limits!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures long-term reliability and protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for easier integration onto PCBs, saving valuable space and simplifying assembly.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this driver can be used in a wide range of applications, enhancing its versatility.

No. of Functions: 2

The dual-functionality provides flexibility, allowing the driver to perform multiple tasks within a single package.

Package Shape: RECTANGULAR

The rectangular package shape enables compact layouts on circuit boards, optimizing design space.

Built-in Protections: TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Comprehensive built-in protections increase the reliability of the driver by safeguarding against common hazards.

Power Supplies (V): 8/36

With a flexible voltage range, it accommodates various power supply scenarios, ensuring compatibility with different systems.

No. of Terminals: 10

Ten terminals provide adequate connectivity options for easy integration into complex circuits.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

Small outline with heat sink capability allows for efficient thermal management and space-saving in designs.

Minimum Supply Voltage: 5.5 V

The low minimum supply voltage expands its use in low-power applications, promoting energy efficiency.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures reliable solderability and good electrical contact integrity.

Terminal Position: DUAL

Dual terminal positioning supports versatile layouts and enhances design flexibility.

Maximum Seated Height: 3.75 mm

A low maximum seated height allows for better fitment in compact designs, ideal for space-constrained applications.

Width: 7.5 mm

The width ensures compatibility with various PCB designs while maintaining a low profile.

Maximum Time At Peak Reflow Temperature (s): 30

Supported peak reflow time enables effective soldering processes during manufacturing, ensuring reliability.

Peak Reflow Temperature °C: 250

High peak reflow temperature tolerance guarantees compatibility with modern soldering techniques.

Length: 9.4 mm

A compact length contributes to minimized board space usage while providing the necessary functionality.

Maximum Output Current: 0.6 A

With a maximum output current of 0.6 A, it can reliably drive various peripherals without concerns of overheating.

Terminal Form: GULL WING

Gull wing terminals offer advantages in automated assembly and ensure strong mechanical connections.

Nominal Supply Voltage: 13 V

A nominal supply voltage of 13 V strikes a balance between performance and efficiency for a variety of applications.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm facilitates easy PCB layout and component placement.

Driver No. of Bits: 2

The 2-bit configuration enables efficient control of peripheral devices, enhancing communication precision.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, which informs storage and handling practices for reliability.

Nominal Output Peak Current Limit: 0.9 A

The nominal output peak current limit of 0.9 A provides headroom for transient loads, ensuring stable operation.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This type of interface IC enhances versatility, allowing for use in various buffer or inverter applications.

Output Current Flow Direction: SOURCE

The output current flow direction as source supports system design flexibility in driving various loads.

Technical Specifications

Peripheral Drivers VND810MSPTR-E attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

10

Output Current Flow Direction:

SOURCE

Maximum Output Current:

.6 A

Nominal Output Peak Current Limit:

.9 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

8/36

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND810MSPTR-E Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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