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STGW50NC60W

STMicroelectronics

STGW50NC60W by STMicroelectronics

STGW50NC60W from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600 V, a power dissipation of 285 W, and operates at up to 150 °C. Ideal for high-performance switching in industrial systems.

Median Price

$8.320

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 165 parts In-Stock

1+ parts

$8.320

100+ parts

$4.846

1k+ parts

$4.083

10k+ parts

-

165

$8.320

$4.846

$4.083

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,055 parts In-Stock

1+ parts

$6.593

100+ parts

-

1k+ parts

-

10k+ parts

-

3,055

$6.593

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-

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Vyrian

USA . 6,352 parts In-Stock

1+ parts

-

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6,352

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Anansix

USA . 2,727 parts In-Stock

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2,727

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R&J Components

USA . 1,035 parts In-Stock

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-

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1,035

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Quantum Digital Technology

USA . 200 parts In-Stock

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,766 parts In-Stock

1+ parts

$0.675

100+ parts

-

1k+ parts

$0.608

10k+ parts

-

1,766

$0.675

-

$0.608

-

MKK Technologies

India . 1,057 parts In-Stock

1+ parts

$1.270

100+ parts

-

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-

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1,057

$1.270

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DigiPath Technology Company

USA . 1,057 parts In-Stock

1+ parts

$1.270

100+ parts

-

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-

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-

1,057

$1.270

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-

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Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$1.542

100+ parts

$1.403

1k+ parts

$1.264

10k+ parts

-

550

$1.542

$1.403

$1.264

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Component Stockers USA

USA . 6,074 parts In-Stock

1+ parts

$4.280

100+ parts

$4.070

1k+ parts

$3.940

10k+ parts

-

6,074

$4.280

$4.070

$3.940

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Corphita

USA . 3,727 parts In-Stock

1+ parts

$6.246

100+ parts

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3,727

$6.246

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Microchip USA

USA . 221 parts In-Stock

1+ parts

$19.236

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221

$19.236

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RC Electronics

USA . 16,385 parts In-Stock

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16,385

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Kepictronics

USA . 10,000 parts In-Stock

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10,000

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Perfect Parts

USA . 1,674 parts In-Stock

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1,674

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Parana Technologies

USA . 1,172 parts In-Stock

1+ parts

-

100+ parts

$0.807

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10k+ parts

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1,172

-

$0.807

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Overview

Unlock unparalleled efficiency and reliability with the STGW50NC60W IGBT from STMicroelectronics. Crafted with precision, this high-performance transistor excels in power control applications, delivering robust performance even under extreme conditions. With a focus on quality and innovation, STMicroelectronics ensures that you benefit from superior thermal management and exceptional switching speeds, empowering your designs to achieve their highest potential. Experience the difference in your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliable performance and longevity, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration provides higher efficiency in power control applications, allowing for better performance.

Configuration: SINGLE

The single configuration simplifies integration into circuits, reducing design complexity.

Transistor Application: POWER CONTROL

Optimized for power control applications, making it ideal for use in motor drives, inverters, and other power electronics.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on printed circuit boards (PCBs).

Terminal Form: THROUGH-HOLE

Through-hole terminals provide excellent mechanical stability and are suitable for high-power applications.

Nominal Turn Off Time (toff): 343 ns

A short turn-off time ensures high-speed switching capabilities, making it effective for dynamic applications.

No. of Terminals: 3

Three terminals facilitate easier connection and integration into circuits, enhancing design flexibility.

Maximum Power Dissipation (Abs): 285 W

High power dissipation capacity ensures reliable operation under demanding conditions, avoiding thermal failures.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure attachment and efficient heat dissipation, ideal for high-power applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures reliable performance under extreme conditions.

Maximum Collector-Emitter Voltage: 600 V

Allows for high voltage operations, making this IGBT suitable for a variety of power electronics applications.

Transistor Element Material: SILICON

Silicon material provides a good balance of performance and cost, widely used in power electronics.

Maximum Gate-Emitter Voltage: 20 V

The gate-emitter voltage capability ensures compatibility with standard driver circuits, simplifying circuit design.

Maximum Collector Current (IC): 100 A

High collector current capacity enables efficient handling of substantial power loads.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A low threshold voltage facilitates easier control and enables the use of lower driving voltages.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and corrosion resistance, enhancing reliability.

Terminal Position: SINGLE

Single terminal position eases design arrangement and integrates seamlessly into existing layouts.

Nominal Turn On Time (ton): 69 ns

A quick turn-on time enhances switching speed, making it suitable for high-frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW50NC60W attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

343 ns

Nominal Turn On Time (ton):

69 ns

Trade Compliance

STGW50NC60W Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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