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STGW40NC60KD

STMicroelectronics

STGW40NC60KD by STMicroelectronics

STGW40NC60KD from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600 V, 70 A collector current, and a fast turn-off time of 338 ns. Ideal for high-performance switching in industrial systems.

Median Price

$5.110

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 90 parts In-Stock

1+ parts

$5.110

100+ parts

$2.896

1k+ parts

-

10k+ parts

-

90

$5.110

$2.896

-

-

EBV Elektronik

Germany . 360 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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360

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-

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,949 parts In-Stock

1+ parts

$4.760

100+ parts

-

1k+ parts

-

10k+ parts

-

1,949

$4.760

-

-

-

TME

Poland . 60 parts In-Stock

1+ parts

$6.050

100+ parts

$4.810

1k+ parts

$4.180

10k+ parts

$3.610

60

$6.050

$4.810

$4.180

$3.610

Vyrian

USA . 3,320 parts In-Stock

1+ parts

-

100+ parts

-

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3,320

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Anansix

USA . 466 parts In-Stock

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466

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ComSIT Distribution GmbH

Germany . 285 parts In-Stock

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285

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 738 parts In-Stock

1+ parts

$1.177

100+ parts

-

1k+ parts

$1.059

10k+ parts

-

738

$1.177

-

$1.059

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MKK Technologies

India . 2,303 parts In-Stock

1+ parts

$2.213

100+ parts

-

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10k+ parts

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2,303

$2.213

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DigiPath Technology Company

USA . 2,303 parts In-Stock

1+ parts

$2.213

100+ parts

-

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2,303

$2.213

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Ampacity Inc.

Singapore . 119 parts In-Stock

1+ parts

$4.260

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-

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119

$4.260

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Corphita

USA . 3,628 parts In-Stock

1+ parts

$4.509

100+ parts

-

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10k+ parts

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3,628

$4.509

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Microchip USA

USA . 4,890 parts In-Stock

1+ parts

$14.728

100+ parts

-

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10k+ parts

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4,890

$14.728

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QUARKTWIN TECHNOLOGY LTD

USA . 3,158 parts In-Stock

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3,158

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Perfect Parts

USA . 1,943 parts In-Stock

1+ parts

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1,943

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A-Z Elektronik GmbH

Germany . 1,662 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,662

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Parana Technologies

USA . 228 parts In-Stock

1+ parts

-

100+ parts

$1.407

1k+ parts

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10k+ parts

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228

-

$1.407

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Overview

Experience the power of efficiency with the STGW40NC60KD IGBT from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers a robust solution ideal for power control applications. This N-channel transistor combines high performance with durability, ensuring reliable operation even in demanding environments. Unlock superior energy savings and enhanced system reliability with this versatile component—perfect for industrial, automotive, and renewable energy sectors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides excellent thermal and mechanical stability, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-Channel devices generally have lower on-state resistance, leading to improved efficiency in power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and enhances versatility in power management tasks.

Transistor Application: POWER CONTROL

This specification confirms suitability for high-power applications, essential for industrial and consumer electronics.

Package Shape: RECTANGULAR

A rectangular shape allows for efficient space utilization on circuit boards, contributing to compact designs.

Terminal Form: THROUGH-HOLE

Through-hole technology ensures robust mechanical connections and is easy to solder for reliable performance.

Nominal Turn Off Time (toff): 338 ns

Fast turn-off time enhances the performance in switching applications, reducing energy losses.

No. of Terminals: 3

With three terminals, this IGBT can be integrated easily into various circuit configurations.

Maximum Power Dissipation (Abs): 250 W

A high power dissipation rating enables the device to manage substantial loads effectively without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for secure mounting in power applications, enhancing the mechanical stability of the installation.

Maximum Operating Temperature: 150 °C

High operating temperature ensures reliability and performance under challenging thermal conditions.

Maximum Collector-Emitter Voltage: 600 V

A voltage rating of 600 V provides robustness, making it suitable for high-voltage applications.

Transistor Element Material: SILICON

Silicon is a proven material in semiconductor technology, providing both efficiency and reliability.

Maximum Gate-Emitter Voltage: 20 V

This specification allows for a wider range of gate drive voltages, accommodating various circuit designs.

Maximum Collector Current (IC): 70 A

High collector current capability supports demanding power applications, ensuring ample load handling.

Maximum Gate-Emitter Threshold Voltage: 6.5 V

A threshold voltage of 6.5 V provides ease of control in driving circuits, enhancing user-friendliness.

Terminal Finish: Matte Tin (Sn)

A matte tin finish improves solderability, ensuring strong electrical connections while protecting against oxidation.

Terminal Position: SINGLE

Single terminal position simplifies layout and design, making it user-friendly for various applications.

Nominal Turn On Time (ton): 64 ns

A swift turn-on time results in minimal delay during operation, ideal for high-performance switching applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW40NC60KD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

338 ns

Nominal Turn On Time (ton):

64 ns

Trade Compliance

STGW40NC60KD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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