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STGW19NC60WD

STMicroelectronics

STGW19NC60WD by STMicroelectronics

STGW19NC60WD from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600V, 42A collector current, and a fast turn-off time of 204ns. Ideal for high-performance switching in industrial systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,003 parts In-Stock

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6,003

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Digiode

USA . 4,702 parts In-Stock

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4,702

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Chip Stock

USA . 3,553 parts In-Stock

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3,553

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Anansix

USA . 2,330 parts In-Stock

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2,330

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,323 parts In-Stock

1+ parts

$0.880

100+ parts

-

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$0.792

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1,323

$0.880

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$0.792

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MKK Technologies

India . 1,206 parts In-Stock

1+ parts

$1.656

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1,206

$1.656

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DigiPath Technology Company

USA . 1,206 parts In-Stock

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$1.656

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1,206

$1.656

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AZTECH Wire

Italy . 789 parts In-Stock

1+ parts

$14.360

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789

$14.360

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A-Z Elektronik GmbH

Germany . 4,674 parts In-Stock

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4,674

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Corphita

USA . 2,679 parts In-Stock

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2,679

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Perfect Parts

USA . 2,531 parts In-Stock

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2,531

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Parana Technologies

USA . 21 parts In-Stock

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$1.053

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21

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$1.053

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Overview

Unlock unparalleled performance with the STGW19NC60WD from STMicroelectronics, a leader in semiconductor innovation. This robust N-channel IGBT delivers exceptional power control, ideal for demanding applications like motor drives and renewable energy systems. Benefiting from superior thermal stability and efficiency, it ensures reliable operation even in extreme conditions. Choose STMicroelectronics for quality you can trust and elevate your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making the IGBT suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer better performance and efficiency, making them ideal for high-speed and high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration simplifies circuit design by integrating a diode, enhancing reliability in power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT excels in managing high voltage and current, making it suitable for various industrial applications.

Package Shape: RECTANGULAR

The rectangular package enables efficient use of space and ease of mounting on PCBs, facilitating better thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide superior mechanical stability and are preferred for applications requiring robust connections.

Nominal Turn Off Time (toff): 204 ns

A fast turn-off time enhances switching efficiency, reducing energy losses in high-frequency applications.

No. of Terminals: 3

Having three terminals simplifies circuit configurations and facilitates effective thermal management in power applications.

Maximum Power Dissipation (Abs): 125 W

With a high power dissipation capacity, this IGBT can handle significant power loads, making it ideal for demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount design enhances heat dissipation and allows for secure attachment to heatsinks, improving thermal management.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliability and durability even in demanding environments.

Maximum Collector-Emitter Voltage: 600 V

The ability to handle up to 600 V makes this IGBT suitable for high voltage applications, expanding its range of usability.

Transistor Element Material: SILICON

Silicon is the standard material for IGBTs, ensuring good electrical performance and thermal stability.

Maximum Gate-Emitter Voltage: 20 V

A higher gate-emitter voltage allows for greater control in switching applications, enhancing performance.

Maximum Collector Current (IC): 42 A

This high current capacity makes the IGBT suitable for heavy-duty applications, ensuring reliable performance under load.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A low threshold voltage allows for easier operation and control, making the device more efficient in low voltage applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish improves solderability and enhances the longevity of the connections.

Terminal Position: SINGLE

A single terminal position simplifies circuit designs and connectivity, improving ease of use.

Nominal Turn On Time (ton): 33 ns

A quick turn-on time leads to improved switching speed, making this IGBT suitable for high-frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW19NC60WD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

204 ns

Nominal Turn On Time (ton):

33 ns

Trade Compliance

STGW19NC60WD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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